TRANSFER METHOD AND THERMAL NANOIMPRINT DEVICE

WIPO Patent Application WO/2013/168634

A1

Using a film (II) for fine pattern formation, which is provided with a cover film (10) that is provided with a nanoscale microrelief structure (11) on one surface, a second mask layer (12) that is provided within a recessed portion of the microrelief structure (11), and a first mask layer (13) that is provided so as to cover the microrelief structure (11) and the second mask layer (12), the first mask layer (13) and the second mask layer (12) are transferred to an object to be processed (20). In this connection, the film (II) for fine pattern formation is pressed against the object to be processed (20), with the surface that is provided with the first mask layer (13) facing the surface of the object to be processed (20); the first mask layer (13) is irradiated with an energy ray; and then the cover film (10) is separated from the second mask layer (12) and the first mask layer (13). In this connection, the pressing and the energy ray irradiation are separately carried out. The object to be processed is etched using the second mask layer (12) and the first mask layer (13).

WO/1996/020672	CASING MATERIAL AND A METHOD AND APPARATUS FOR ITS MANUFACTURE
JPH0387258	EMBOSSED MULTILAYER RESIN ORIENTED FILM
WO/2018/124992	METHOD AND APPARATUS FOR PRODUCING HOOK FASTENERS

HOSOMI NAOKI (JP)
KOIKE JUN (JP)
YAMAGUCHI FUJITO (JP)

PCT/JP2013/062590

November 14, 2013

April 30, 2013

Click for automatic bibliography generation  

ASAHI KASEI E MATERIALS CORP (JP)

B29C59/04; B29C65/02; H01L21/027; B29L7/00

JP2010284814A	2010-12-24
JP2007144995A	2007-06-14
JP2010105210A	2010-05-13
JP2011020272A	2011-02-03
JP2011020272A	2011-02-03
JP4943876B2	2012-05-30

See also references of EP 2848391A4

AOKI, HIROYOSHI (JP)
Hiroyoshi Aoki (JP)

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