TRANSFER-MOLDING-TYPE SENSOR DEVICE

WIPO Patent Application WO/2014/208116

A1

In order to provide a highly reliable transfer-molding-type sensor device in which, by suppressing the deformation of a composite sensor having internal functions for measuring prescribed physical quantities such as acceleration and angular velocity, stress resulting from deformation is reduced and which is made compact, in a transfer-molding-type sensor device having a package formed such that a composite sensor composed from a plurality of sensors having physical quantity detection functions, a substrate for processing signals from the composite sensor and controlling signal input from and output to the outside, a chip pad having the composite sensor and substrate mounted thereon, and a lead member are sealed by a mold resin, the composite sensor is formed so as to be thicker than the substrate and the chip pad, the main surface side of the composite sensor is covered by the mold resin, the rear surface side of the composite sensor is in contact with the substrate via a bonding material, and the composite sensor is disposed on the neutral plane of the package in a cross section of the package thickness direction including the composite sensor, the substrate, and the chip pad.

YAGUCHI AKIHIRO (JP)
HAYASHI MASAHIDE (JP)
OHTA KAZUNORI (JP)
OKAMOTO AKIHIRO (JP)

PCT/JP2014/052610

December 31, 2014

February 05, 2014

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HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

G01P15/08; G01C19/5783; H01L23/28; H01L25/065; H01L25/07; H01L25/18; H01L29/84

US20090282917A1	2009-11-19
JP2010177510A	2010-08-12

INOUE Manabu et al. (JP)
Manabu Inoue (JP)

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