TRANSFER MOULDING INDUCTIVE ELEMENT AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2018/219367

A3

Disclosed are a transfer moulding inductive element and a manufacturing method therefor. The element comprises: a magnetic body formed from a soft magnetic gel by means of transfer moulding; a prefabricated coil assembly, comprising a hollow coil and electrode pieces connected to two end portions of the hollow coil, the coil assembly being filled with the soft magnetic gel during the transfer moulding so that the whole hollow coil is located inside the magnetic body, the electrode pieces connected to the two end portions of the hollow coil being at least partially exposed on the outside of the magnetic body so as to form end electrodes. The manufacturing method comprises: soldering the prefabricated hollow coil and the electrode pieces to form the coil assembly, and placing in a cavity of a prefabricated mould; performing the transfer moulding with the gelatinous soft magnetic gel, so that the whole hollow coil is filled in the gelatinous soft magnetic gel, the electrode pieces at the two end portions of the hollow coil being at least partially exposed on the outside of the soft magnetic gel to act as the end electrodes; performing de-moulding after the soft magnetic gel in the mould has cured and formed the magnetic body, arranging the end electrodes, and obtaining the transfer moulding inductive element.

YU XINSHU (CN)
XIA SHENGCHENG (CN)

PCT/CN2018/105406

February 07, 2019

September 13, 2018

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SHENZHEN SUNLORD ELECTRONICS (CN)

H01F17/04; H01F27/29; H01F27/30

CN206271495U	2017-06-20
CN205542250U	2016-08-31
CN107564698A	2018-01-09
CN202796373U	2013-03-13
CN106653307A	2017-05-10
US20100090790A1	2010-04-15

CHINA TRUER IP (CN)

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