Title:
TRANSFER ROBOT WITH SUBSTRATE COOLING
Document Type and Number:
WIPO Patent Application WO/2011/090905
Kind Code:
A3
Abstract:
Embodiments of the present invention provide a transfer robot having a cooling plate attached thereto for cooling a substrate during transfer between a processing chamber and a load lock chamber. In one embodiment, the cooling plate is a single, large area cooling plate attached to the transfer robot beneath the substrate being transferred. In another embodiment, the cooling plate is an array of substrates attached to the transfer robot beneath the substrate being transferred. The cooling plate may include a conduit path for circulating a cooling fluid throughout the cooling plate. The cooling plate may have an upper surface with a high emissivity coating applied thereto.
Inventors:
KURITA SHINICHI (US)
INAGAWA MAKOTO (US)
MATSUMOTO TAKAYUKI (US)
INAGAWA MAKOTO (US)
MATSUMOTO TAKAYUKI (US)
Application Number:
PCT/US2011/021286
Publication Date:
November 17, 2011
Filing Date:
January 14, 2011
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
KURITA SHINICHI (US)
INAGAWA MAKOTO (US)
MATSUMOTO TAKAYUKI (US)
KURITA SHINICHI (US)
INAGAWA MAKOTO (US)
MATSUMOTO TAKAYUKI (US)
International Classes:
H01L21/677; B25J15/08; B65G49/06
Foreign References:
| JP2002289669A | 2002-10-04 | |||
| JPH1187463A | 1999-03-30 | |||
| JPH11176910A | 1999-07-02 | |||
| JP2002346965A | 2002-12-04 | |||
| JP2008279538A | 2008-11-20 |
Attorney, Agent or Firm:
PATTERSON, B. Todd et al. (L.L.P.3040 Post Oak Blvd., Suite 150, Houston Texas, US)
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