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Patent Searching and Data


Title:
TRANSFER SUBSTRATE, METHOD OF FABRICATING MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, AND MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/062750
Kind Code:
A1
Abstract:
A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.

Inventors:
FANG LIYU (CN)
SUN LINGYU (CN)
DU JINGJUN (CN)
LIANG FEI (CN)
HOU TINGXIU (CN)
Application Number:
PCT/CN2019/074840
Publication Date:
April 02, 2020
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H01L21/683; H01L27/12
Foreign References:
CN109273459A2019-01-25
CN108281368A2018-07-13
CN108389825A2018-08-10
CN108257905A2018-07-06
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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