Title:
TRANSFER-TYPE PHOTOSENSITIVE FILM, METHOD FOR FORMING RESIN CURED FILM AND METHOD FOR PRODUCING SUBSTRATE WITH RESIN CURED FILM
Document Type and Number:
WIPO Patent Application WO/2020/261523
Kind Code:
A1
Abstract:
This transfer-type photosensitive film has a structure wherein a support film, an intermediate layer containing a water-soluble polymer, and a photosensitive resin layer are sequentially stacked in this order; the photosensitive resin layer has a thickness of 2 μm or less; the intermediate layer has a thickness of from 5 μm to 20 μm; and the content of particles, which are present in the intermediate layer and have a diameter that is more than 0.5 times the thickness of the intermediate layer, is 50 particles/m2 or less.
Inventors:
YOSHIDA HIDEKI (JP)
EBIHARA MASAHIKO (JP)
MUKAI IKUO (JP)
MUTOH NOBUYOSHI (JP)
EBIHARA MASAHIKO (JP)
MUKAI IKUO (JP)
MUTOH NOBUYOSHI (JP)
Application Number:
PCT/JP2019/025750
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
G03F7/004; G01N27/00; G03F7/11
Domestic Patent References:
| WO2009096292A1 | 2009-08-06 | |||
| WO2016175220A1 | 2016-11-03 | |||
| WO2017018299A1 | 2017-02-02 |
Foreign References:
| KR20110077753A | 2011-07-07 | |||
| JP2017111044A | 2017-06-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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