Title:
TRANSMISSION LINE BOARD
Document Type and Number:
WIPO Patent Application WO/2023/053175
Kind Code:
A1
Abstract:
This transmission line board includes: a first transmission line (104) that has a first line length, is formed on a substrate (101) made of a dielectric, and connects a first integrated circuit (102) and a second integrated circuit (103) to each other; a first dielectric layer (105) that has a first permittivity and is formed to cover the first integrated circuit (102), the second integrated circuit (103), and the first transmission line (104); a second dielectric layer (106) that has a second permittivity and is formed on the first dielectric layer (105); a first via (107) that has a columnar shape and is connected to the first integrated circuit (102); a second via (108) that has a columnar shape and is connected to the second integrated circuit (103); and a second transmission line (109) that has a second line length, is formed in the second dielectric layer (106), and is connected to the first via (107) and the second via (108). The first permittivity and the second permittivity are set such that a signal transmission time in the first transmission line (104) becomes the same as a signal transmission time in the second transmission line (109).
Inventors:
MUTO MIWA (JP)
MATSUZAKI HIDEAKI (JP)
MATSUZAKI HIDEAKI (JP)
Application Number:
PCT/JP2021/035567
Publication Date:
April 06, 2023
Filing Date:
September 28, 2021
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01P3/08; H05K3/46
Foreign References:
| JP2002111324A | 2002-04-12 | |||
| JP2002368431A | 2002-12-20 | |||
| JPS53135459A | 1978-11-27 |
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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