Title:
TRANSMISSION LINE AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/065883
Kind Code:
A1
Abstract:
According to the present invention, a first interlayer connection conductor connects a first signal conductor and a first mounting electrode, a second interlayer connection conductor connects a second signal conductor and a second mounting electrode, and a plurality of third interlayer connection conductors and a plurality of fourth interlayer connection conductors connect a first ground conductor and a second ground conductor between the first signal conductor and the second signal conductor. The third interlayer connection conductor is closer to the first interlayer connection conductor and the second interlayer connection conductor than the fourth interlayer connection conductor, the adjacent distance between two of the fourth interlayer connection conductors is greater than the adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than a half of the minimum wavelength of a signal transmitted by the first signal conductor and the second signal conductor.
Inventors:
NAGAI TOMOHIRO (JP)
TENNO NOBUYUKI (JP)
TENNO NOBUYUKI (JP)
Application Number:
PCT/JP2020/036831
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/02; H01P3/08; H05K1/02; H05K1/18; H05K3/46
Domestic Patent References:
| WO2017199930A1 | 2017-11-23 | |||
| WO2016163436A1 | 2016-10-13 |
Foreign References:
| JP2013026601A | 2013-02-04 | |||
| JP2010050627A | 2010-03-04 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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