TRANSPARENT CONDUCTIVE FILM, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Title:

TRANSPARENT CONDUCTIVE FILM, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2012/056774

Kind Code:

A1

Abstract:

The present invention provides a transparent conductive film which has low surface resistivity and high transparency. This transparent conductive film has an adhesive conductive layer at an opening portion of a conductive metal mesh layer that is provided on at least one surface of a transparent base. This transparent conductive film is characterized in that: the conductive layer is composed of a conductive adhesive composition that contains (A) a water-soluble vinyl polymer, (B) an organic additive and (C) a conductive organic polymer compound; the organic additive (B) is composed of at least one substance selected from among water-soluble polyhydric alcohols, water-soluble pyrrolidones and hydrophilic aprotic solvents; and the conductive organic polymer compound (C) is composed of at least one substance selected from among polyanilines, polypyrroles, polythiophenes and derivatives of polyanilines, polypyrroles and polythiophenes. The present invention also provides: an electronic device which is characterized by comprising the above-described transparent conductive film; and a method for manufacturing an electronic device, which is characterized by forming the photoelectric conversion layer on a negative electrode layer and bonding a conductive layer of a transparent conductive film to the surface of the photoelectric conversion layer at a temperature, at which the conductive adhesive composition is softened, or higher.

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Inventors:

KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
UEMURA KAZUE (JP)
NAKAJIMA EMI (JP)

Application Number:

PCT/JP2011/066495

Publication Date:

May 03, 2012

Filing Date:

July 20, 2011

Export Citation:

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Assignee:

LINTEC CORP (JP)
KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
UEMURA KAZUE (JP)
NAKAJIMA EMI (JP)

International Classes:

H01B5/14; B32B3/24; B32B7/02; B32B27/18; B32B27/30; C08J7/043; C08J7/044

Foreign References:

JP2008288102A	2008-11-27
JP2009146678A	2009-07-02
JP2007305351A	2007-11-22
JP2009500832A	2009-01-08
JP2009259479A	2009-11-05
JP2009140788A	2009-06-25
JP2007305351A	2007-11-22
JP2008288102A	2008-11-27
JP2009146678A	2009-07-02
JP2006352073A	2006-12-28
JP2009500832A	2009-01-08

Other References: