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Title:
TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/082652
Kind Code:
A1
Abstract:
Provided is a transparent conductive film, which is an oxide film the primary component of which is silicon oxide and which encapsulates a mesh-like structure formed from metal microparticles. Also provided is a substrate on which a transparent conductive film is laminated wherein the transparent conductive film is laminated on a glass or ceramic substrate. Further provided is a method for producing the same. The substrate on which the transparent conductive film is laminated has a high transmission rate and high conductivity, the surface is smooth, and said substrate comprises a mesh-like structure formed from metal microparticles having excellent heat resistance and weather resistance.

Inventors:
KAKIHARA, Yasuo (Otake Research & Development Center 1-4, Meijishinkai, Otake-sh, Hiroshima 52, 〒7390652, JP)
柿原康男 (〒52 広島県大竹市明治新開1番4戸田工業株式会社大竹創造センター内 Hiroshima, 〒7390652, JP)
Application Number:
JP2010/050504
Publication Date:
July 22, 2010
Filing Date:
January 18, 2010
Export Citation:
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Assignee:
TODA KOGYO CORPORATION (1-4 Meijishinkai, Otake-shi Hiroshima, 52, 〒7390652, JP)
戸田工業株式会社 (〒52 広島県大竹市明治新開1番4 Hiroshima, 〒7390652, JP)
FUJICOPIAN CO.,LTD (8-43, Utajima 4-chome Nishiyodogawa-ku, Osaka-sh, Osaka 21, 〒5550021, JP)
フジコピアン株式会社 (〒21 大阪府大阪市西淀川区歌島四丁目8番43号 Osaka, 〒5550021, JP)
International Classes:
H01B5/14; B32B7/02; B32B18/00; H01B13/00; H05K9/00
Attorney, Agent or Firm:
OKADA, Kazuhiko (Okada & Associates, 6F Kudan Kangyo Bldg., 10-1, Kudankita 1-chom, Chiyoda-ku Tokyo 73, 〒1020073, JP)
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