Title:
TRANSPARENT CONDUCTIVE FILM LAMINATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/286602
Kind Code:
A1
Abstract:
[Problem] To provide a transparent conductive film laminate and a method for manufacturing the same, whereby, when an amorphous cycloolefin-based resin is used in a base material of a transparent conductive film, curling of a transparent conductive film laminate during a heating process is suppressed, the yield of a subsequent process can be ensured, and manufacturing costs can be reduced. [Solution] Provided is a transparent conductive film laminate containing a transparent conductive film 10 and a carrier film 1 laminated thereto. The transparent conductive film 10 is obtained by laminating a transparent conductive layer 3, that contains a fine metal wire, and an overcoat layer 4, in this order, onto one main surface of a transparent resin film 2 comprising an amorphous cycloolefin-based resin (thickness Ts = 30 to 150 µm). The carrier film 1 comprises a polyolefin film, and only one main surface of the carrier film 1 is adhesive. The transparent conductive film 10 is releasably laminated to the one adhesive main surface of the carrier film 1 such that the overcoat layer 4 becomes the outermost layer. The ratio (Tc/Ts) of the thickness Tc of the carrier film 1 to the thickness Ts of the transparent resin film 2 satisfies 0.2 ≦ Tc/Ts ≦ 0.8.
Inventors:
YAMAKI SHIGERU (JP)
YONEDA SHUHEI (JP)
YONEDA SHUHEI (JP)
Application Number:
PCT/JP2022/025919
Publication Date:
January 19, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01B5/14; B32B7/025; B32B15/085; B32B27/32
Domestic Patent References:
| WO2021075424A1 | 2021-04-22 |
Foreign References:
| JP2020088112A | 2020-06-04 |
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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