Title:
TRANSPARENT CONDUCTIVE FILM MANUFACTURING METHOD, TRANSPARENT CONDUCTIVE FILM, AND INPUT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/155937
Kind Code:
A1
Abstract:
In the present invention, resist films are formed on a transparent conductive layer on one surface of a transparent insulating layer, and a transparent conductive layer on the other surface of the transparent insulating layer, respectively. The resist films on the one surface and the other surface have different photosensitive wavelength distributions. Exposure light beams are respectively radiated to the resist films on the one surface and the other surface. The exposure light beams have different intensity distributions. The photosensitive wavelength distributions of the resist films on the one surface and the other surface respectively include a peak having a wavelength of 365 nm, and a peak having a wavelength of 436 nm. In the photosensitive wavelength distribution of the resist film on the one surface, a photosensitivity with respect to a wavelength of 365 nm is higher than a photosensitivity with respect to a wavelength of 436 nm. Furthermore, in the photosensitive wavelength distribution of the resist film on the other surface, a photosensitivity with respect to a wavelength of 436 nm is higher than a photosensitivity with respect to a wavelength of 365 nm.
Inventors:
TAKEMURA KEIJI (JP)
Application Number:
PCT/JP2014/000702
Publication Date:
October 02, 2014
Filing Date:
February 10, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
G06F3/041; G06F3/044; H01B5/14; H01B13/00
Foreign References:
| JP2002014464A | 2002-01-18 | |||
| JP2009205379A | 2009-09-10 |
Attorney, Agent or Firm:
FUKUSHIMA, Yoshito (JP)
Yoshihito Fukushima (JP)
Yoshihito Fukushima (JP)
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