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Title:
TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2007/043569
Kind Code:
A1
Abstract:
Disclosed is a transparent conductive film having high conductivity and sufficient film strength. Specifically disclosed is a transparent conductive film composed of a metal thin film having a planar network structure. Also specifically disclosed is a method for producing a transparent conductive film comprising (a) a step wherein an emulsion solution in which polymer particles are dispersed is applied over a substrate for forming a single-layer film of the polymer particles, (b) a step wherein the thus-formed single-layer film is heated for forming a single-layer planar network structure, (c) a step wherein metal nanoparticles are applied over the substrate having the thus-formed single-layer planar network structure, and (d) a step wherein the metal nanoparticles are fusion-bonded by heating.

Inventors:
HIGASHITANI KO (JP)
KANDA YOICHI (JP)
Application Number:
PCT/JP2006/320297
Publication Date:
April 19, 2007
Filing Date:
October 11, 2006
Export Citation:
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Assignee:
UNIV KYOTO (JP)
HIGASHITANI KO (JP)
KANDA YOICHI (JP)
International Classes:
H01B5/14; B32B15/08; H01B13/00
Domestic Patent References:
WO2003068674A12003-08-21
WO2006040989A12006-04-20
Foreign References:
JP2001331654A2001-11-30
JP2004228057A2004-08-12
JP2004281941A2004-10-07
JP2005154453A2005-06-16
JPH10312715A1998-11-24
JP2003071976A2003-03-12
JP2006127929A2006-05-18
JP2006032197A2006-02-02
Attorney, Agent or Firm:
ASAHINA, Sohta (2-22 Tanimachi 2-chome, Chuo-k, Osaka-shi Osaka 12, JP)
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