TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL

WIPO Patent Application WO/2006/038494

A1

Disclosed is a transparent conductive film wherein a hard coat layer is arranged on one side of a transparent film base, an SiO_x film having a thickness of 10-300 nm is formed on the hard coat layer by a dry process, and a transparent conductive thin film having a thickness of 20-35 nm is arranged on the other side of the transparent film base. Such a transparent conductive film has good wet heat resistance and excellent durability to pen-based input, and enables to suppress occurrence of cracks during a punching process. In addition, occurrence of swell or curl can be suppressed in such a transparent conductive film even under high temperature, high humidity conditions.

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NASHIKI TOMOTAKE (JP)
SUGAWARA HIDEO (JP)
ANDOU HIDEHIKO (JP)
YOSHITAKE HIDETOSHI (JP)

PCT/JP2005/017741

April 13, 2006

September 27, 2005

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NITTO DENKO CORP (JP)
NASHIKI TOMOTAKE (JP)
SUGAWARA HIDEO (JP)
ANDOU HIDEHIKO (JP)
YOSHITAKE HIDETOSHI (JP)

G02B1/10; B32B9/00; C23C14/06; G06F3/041; H01B5/14

JP2003002985A	2003-01-08
JPH08167726A	1996-06-25

Suzuki, Takao (13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, JP)

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