Title:
TRANSPARENT CONDUCTIVE FILMS WITH EMBEDDED METAL GRIDS
Document Type and Number:
WIPO Patent Application WO/2016/188308
Kind Code:
A1
Abstract:
A transparent conductive film with a metal mesh embedded in a substrate and a method of fabrication thereof is provided. The metal mesh has a cap that is pressed and embedded in a substrate or a deformable material on a substrate, providing superior mechanical stability by mechanical interlocking. The embedding mechanism also provides superior chemical and environmental stability. A fabrication method is provided and includes a vacuum-free and low-cost process for large-volume manufacturing of the transparent conductive film with tunable performance.
Inventors:
LI WENDI (CN)
KHAN ARSHAD (PK)
KHAN ARSHAD (PK)
Application Number:
PCT/CN2016/081100
Publication Date:
December 01, 2016
Filing Date:
May 05, 2016
Export Citation:
Assignee:
VERSITECH LTD (CN)
International Classes:
H01B5/14; G06F3/041; H01L31/0224
Foreign References:
| US20140360757A1 | 2014-12-11 | |||
| US6153901A | 2000-11-28 | |||
| CN102222538A | 2011-10-19 | |||
| CN204257226U | 2015-04-08 | |||
| CN104571676A | 2015-04-29 |
Other References:
See also references of EP 3298612A4
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (Great Eagle Center23 Harbour Road, Wanchai, Hong Kong, CN)
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