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Title:
TRANSPARENT ELECTRODE-EQUIPPED SUBSTRATE AND METHOD FOR PRODUCING TRANSPARENT ELECTRODE-EQUIPPED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/152808
Kind Code:
A1
Abstract:
A transparent electrode-equipped substrate (21) is provided with a metal oxide transparent electrode layer (13) on a transparent substrate (12). The average maximum curvature Ssc of the surface of the transparent electrode layer is preferably 5.4 × 10-4 nm-1 or less. For example, if the transparent electrode layer is subjected to a surface treatment by low discharge-power sputtering after film formation, the Ssc of the transparent electrode layer can be reduced. This transparent electrode-equipped substrate excels in close adhesion between the transparent electrode layer (13) and a metal lead wire (14) disposed on the transparent electrode layer. The transparent electrode layer (13) is obtained by, for example, performing a transparent electrode film-production step through the application of a first discharge power and then performing a surface treatment step through the application of a second discharge power.

Inventors:
HAYAKAWA, Hironori (2-1-1 Hieitsuji, Otsu-sh, Shiga 04, 〒5200104, JP)
OMOTO, Shinya (1-1 Torikainishi 5-chome, Settsu-sh, Osaka 72, 〒5660072, JP)
KUCHIYAMA, Takashi (1-1 Torikainishi 5-chome, Settsu-sh, Osaka 72, 〒5660072, JP)
Application Number:
JP2016/058808
Publication Date:
September 29, 2016
Filing Date:
March 18, 2016
Export Citation:
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Assignee:
KANEKA CORPORATION (3-18, Nakanoshima 2-chome Kita-ku, Osaka-sh, Osaka 88, 〒5308288, JP)
International Classes:
C23C14/58; B32B7/02; C23C14/08; C23C14/34; G06F3/041; H01B5/14; H01B13/00
Foreign References:
JPS61290607A1986-12-20
JPS61290605A1986-12-20
JP2010110897A2010-05-20
JPH11200033A1999-07-27
JPH0729884A1995-01-31
JP2006219357A2006-08-24
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (IZANAGI IP LAW FIRM, Toa Bldg. 5-7, Minamihonmachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
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