Title:
TRANSPARENT MATERIAL PROCESSING METHOD, TRANSPARENT MATERIAL PROCESSING DEVICE, AND TRANSPARENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/135362
Kind Code:
A1
Abstract:
The present invention enables simple and efficient material processing. This transparent material processing method is for processing a thermosetting transparent material. The transparent material processing method includes: a disposing step (S01) for disposing a pre-thermosetting thermosetting transparent material; a laser beam emission step (S02) for emitting a laser beam onto the disposed pre-thermosetting thermosetting transparent material to form cavitation bubbles in the pre-thermosetting thermosetting transparent material; and a curing step (S03) for curing the pre-thermosetting thermosetting transparent material that includes cavitation bubbles formed therein.
Inventors:
HANADA YASUTAKA (JP)
Application Number:
PCT/JP2018/047072
Publication Date:
July 11, 2019
Filing Date:
December 20, 2018
Export Citation:
Assignee:
UNIV HIROSAKI (JP)
International Classes:
B23K26/57; B23K26/55
Domestic Patent References:
| WO2017057723A1 | 2017-04-06 |
Foreign References:
| JPH0897513A | 1996-04-12 | |||
| JP2004306134A | 2004-11-04 | |||
| JPH09216292A | 1997-08-19 | |||
| JPH08156109A | 1996-06-18 | |||
| JP2007245460A | 2007-09-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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