Title:
TRANSPARENT POLYIMIDE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
Document Type and Number:
WIPO Patent Application WO/2014/092422
Kind Code:
A1
Abstract:
The present invention provides a transparent polyimide substrate comprising a transparent polyimide film and a cured layer of a polyisocyanate formed on at least one surface of the transparent polyimide film, the polyisocyanate containing an acrylate group and having 2 to 5 isocyanate groups per molecule. The transparent polyimide substrate has excellent scratch resistance, solvent resistance, optical properties and flexibility and low water permeability and is useful as a cover substrate for a flexible electronic device.
Inventors:
WOO HAK YONG (KR)
JUNG HAK GEE (KR)
PARK HYO JUN (KR)
JUNG HAK GEE (KR)
PARK HYO JUN (KR)
Application Number:
PCT/KR2013/011382
Publication Date:
June 19, 2014
Filing Date:
December 10, 2013
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
C08J5/18; C08J7/046; C09D175/00; G02B1/10
Foreign References:
| US20030130475A1 | 2003-07-10 | |||
| KR20120078510A | 2012-07-10 | |||
| EP2218754A1 | 2010-08-18 | |||
| US20080226924A1 | 2008-09-18 | |||
| US20110189450A1 | 2011-08-04 |
Other References:
See also references of EP 2931795A4
Attorney, Agent or Firm:
KONG, Min Ho et al. (BYC Building 648-1, Yeoksam-dong,Gangnam-gu, Seoul 135-080, KR)
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