Title:
TRANSPARENT RESIN COMPOSITION, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2016/186121
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a resin composition exhibiting excellent transparency and heat resistance, and which has no externally visible defects when injection molded. This resin composition contains: a styrene resin (A) comprising a copolymer including an unsaturated dicarboxylic acid anhydride monomer unit; and a transparent resin (B) other than the styrene resin (A). When measured according to ASTM D1003 at a thickness of 2mm, the resin composition has a total luminous transmittance of at least 88% and a haze value of at most 0.3%. The styrene resin (A) is preferably a copolymer comprising 45-90 mass% of a styrene monomer unit, and 10-55 mass% of an unsaturated dicarboxylic acid anhydride monomer unit, a (meth)acrylic acid monomer unit, a (meth)acrylic acid ester monomer unit, etc. The transparent resin (B) is preferably at least one selected from a methacrylic resin, a methyl methacrylate-styrene copolymer, and a styrene-acrylonitrile copolymer.
Inventors:
NISHINO KOHHEI (JP)
KOBAYASHI TOMOKI (JP)
SHIMOKOBA YUICHI (JP)
KUROKAWA YOSHINARI (JP)
KOBAYASHI TOMOKI (JP)
SHIMOKOBA YUICHI (JP)
KUROKAWA YOSHINARI (JP)
Application Number:
PCT/JP2016/064684
Publication Date:
November 24, 2016
Filing Date:
May 18, 2016
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L101/12; B29B7/30; B29C45/00; C08J3/20; C08L25/08; C08L33/10; C08L35/06
Domestic Patent References:
WO2009084382A1 | 2009-07-09 | |||
WO1998028365A1 | 1998-07-02 |
Foreign References:
JP2009282146A | 2009-12-03 | |||
JP2010070646A | 2010-04-02 | |||
US6040382A | 2000-03-21 | |||
US4647620A | 1987-03-03 | |||
JPH0732357A | 1995-02-03 | |||
JPH0671640A | 1994-03-15 | |||
JPH0347709A | 1991-02-28 | |||
JPS49132126A | 1974-12-18 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK特許業務法人 (JP)
SK特許業務法人 (JP)
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