Title:
TRANSPARENT SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/065195
Kind Code:
A1
Abstract:
[Problem] To provide a transparent substrate that expresses different conductivity without processing conductive fibers contained in a conductive fiber containing layer to constitute a low resistance part (conductive part) and a high resistance part (non-conductive part) and has fine invisibility in the low resistance part (conductive part) and the high resistance part (non-conductive part), and a manufacturing method therefor.
[Solution] This transparent substrate comprises: a transparent base material; and a conductive fiber-containing layer that is laminated on at least one principal surface of the transparent base material and contains conductive fibers and a binder resin substantially evenly dispersed in a plane view. The transparent substrate has a high resistance part in which an undercoat layer is interposed and a low resistance part in which the undercoat layer is not interposed in a part between the transparent base material and the conductive fiber containing layer. The relationship between a sheet resistance value RH of the high resistance part and a sheet resistance value RL of the low resistance part is expressed as RH/RL > 100. The undercoat layer contains a resin having at least one of a group having (-NH-) and a coupling part.
Inventors:
TOBA MASAHIKO (JP)
Application Number:
PCT/JP2021/034123
Publication Date:
March 31, 2022
Filing Date:
September 16, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B32B5/16; B32B7/025; H01B1/00; H01B1/22; H01B5/14; H01B13/00
Domestic Patent References:
| WO2014103573A1 | 2014-07-03 | |||
| WO2014077063A1 | 2014-05-22 |
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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