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Title:
TREATED SURFACE COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/012327
Kind Code:
A1
Abstract:
Provided is a treated surface copper foil capable of rendering a post-copper foil removal substrate surface profile that achieves favorable electroless copper plating film adhesion strength while maintaining the ability to form microwiring. Also provided is a resin substrate with a surface profile that achieves favorable electroless copper plating film adhesion strength while maintaining the ability to form microwiring. For this treated surface copper foil in which a treated surface layer is formed on a copper foil, the surface roughness (Sz) of the surface of the treated surface layer is 2 - 6 µm.

Inventors:
ISHII MASAFUMI (JP)
HONDA MISATO (JP)
MIYAMOTO NOBUAKI (JP)
Application Number:
PCT/JP2014/069489
Publication Date:
January 29, 2015
Filing Date:
July 23, 2014
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B32B15/08; H05K1/09; H05K3/18; H05K3/38
Domestic Patent References:
WO2012043182A12012-04-05
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Other References:
See also references of EP 3026145A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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