Title:
TREATING DEVICE AND HEATER UNIT
Document Type and Number:
WIPO Patent Application WO/2006/004045
Kind Code:
A1
Abstract:
A treating device and a heater unit. The treating device comprises a loading table formed so that cracking does not occur therein due to the heating of heaters buried therein. The loading table (32A) for placing a wafer (W) thereon further comprises a plurality of areas (32Aa) and (32Ab), and one of the plurality of heaters is buried in each of the plurality of areas independently of each other. The heater (35Aa) buried in one area (32Aa) of the areas adjacent to each other comprises a portion (35Aa2) extending into the other area (32Ab), and the heater (35Ab) buried in the other area (32Ab) of the areas adjacent to each other comprises a portion (35Ab2) extending into one area (32Aa).
Inventors:
MURAKAMI SEISHI (JP)
TADA KUNIHIRO (JP)
TADA KUNIHIRO (JP)
Application Number:
PCT/JP2005/012217
Publication Date:
January 12, 2006
Filing Date:
July 01, 2005
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
MURAKAMI SEISHI (JP)
TADA KUNIHIRO (JP)
MURAKAMI SEISHI (JP)
TADA KUNIHIRO (JP)
International Classes:
C23C16/46; H01L21/205; H01L21/31; H05B3/10; H05B3/12; H05B3/74; (IPC1-7): C23C16/46; H01L21/205; H01L21/31; H05B3/10; H05B3/12; H05B3/74
Foreign References:
JP2002373846A | 2002-12-26 | |||
JPH0273979A | 1990-03-13 |
Attorney, Agent or Firm:
Itoh, Tadahiko (Yebisu Garden Place Tower, 20-3, Ebisu 4-Chome, Shibuya-Ku Tokyo, JP)
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