Title:
TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/170942
Kind Code:
A1
Abstract:
A treatment composition for chemical mechanical polishing which is for treating a work in which a metal-containing wiring layer has been disposed, the treatment composition comprising (A) a nitrogenous compound, (B) at least one compound selected from the group consisting of surfactants and poly(acrylic acid), and (D) a pH regulator. In an examination for electrode charge transfer resistance by an alternating-current impedance measurement using the metal as an electrode, the sum of the electrode charge transfer resistances (RA+RB) measured in an aqueous solution of (A) and (D) and an aqueous solution of (B) and (D) and the electrode charge transfer resistance (RC) measured in an aqueous solution of (A), (B), and (D) satisfy the relationship RC/(RA+RB)>1.
Inventors:
MITSUMOTO KIYOTAKA (JP)
KAWAMOTO TATSUYOSHI (JP)
YAMANAKA TATSUYA (JP)
ARAKAWA MEGUMI (JP)
KUNITANI EIICHIROU (JP)
IIDA MASASHI (JP)
KAWAMOTO TATSUYOSHI (JP)
YAMANAKA TATSUYA (JP)
ARAKAWA MEGUMI (JP)
KUNITANI EIICHIROU (JP)
IIDA MASASHI (JP)
Application Number:
PCT/JP2016/060449
Publication Date:
October 27, 2016
Filing Date:
March 30, 2016
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| WO2011093195A1 | 2011-08-04 |
Foreign References:
| JP2015043371A | 2015-03-05 |
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
Obuchi Yoshikazu glory (JP)
Obuchi Yoshikazu glory (JP)
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