Title:
TREATMENT DEVICE, PLATING APPARATUS EQUIPPED WITH SAME, CONVEYING DEVICE, AND TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/096768
Kind Code:
A1
Abstract:
The present invention stably conveys a substrate (to-be-treated item) while minimizing flexure of the to-be-treated item. Provided is a treatment device that has: a conveyor part which conveys the to-be-treated item such that a flat surface of the to-be-treated item is inclined about a conveyance direction axis with respect to the horizontal plane; and a treatment part which performs polishing and/or cleansing of the flat surface of the to-be-treated item. The conveyor part has: a drive part which is configured to come into physical contact with an end of the to-be-treated item and apply force in the conveyance direction on the to-be-treated item; a first Bernoulli chuck which is disposed so as to face the flat surface of the to-be-treated item; and a second Bernoulli chuck which is disposed so as to face an end face at an end on the side opposite to the aforementioned end of the to-be-treated item.
Inventors:
ITO KENYA (JP)
UEDA HIROHIKO (JP)
UEDA HIROHIKO (JP)
Application Number:
PCT/JP2017/032775
Publication Date:
May 31, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/677; B65G49/00; B65G49/07; C25D17/06; H01L21/304; H01L21/683
Foreign References:
| JP2004123254A | 2004-04-22 | |||
| JP2009263077A | 2009-11-12 | |||
| JP2002261143A | 2002-09-13 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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