Title:
TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/106979
Kind Code:
A1
Abstract:
[Problem] To perform highly uniform treatment within the surface of a substrate by attracting and holding the substrate with high reliability when the substrate is treated in an atmosphere where no plasma is formed. [Solution] The present invention configures a device so as to be provided with: a DC power supply 35 the positive electrode side of which is connected to one of an electrode 32 of an electrostatic chuck 3 and a conductive member 4 and the negative electrode side of which is connected to the other, that applies a voltage across the electrode 32 and the conductive member 4 located at a treatment position in contact with a substrate W in a state where no plasma is formed in a treatment container 11, and that causes an electrostatically attracting force generated thereby to attract and hold the substrate W on a dielectric layer 31 of the electrostatic chuck 3; and a treatment-gas supply part 28 that supplies a treatment gas to the substrate W to treat the substrate W in a state where the substrate W is attracted to and held on the dielectric layer 31.
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Inventors:
FUJISATO TOSHIAKI (JP)
ISHIZAKA TADAHIRO (JP)
MOCHIZUKI TAKASHI (JP)
TORIYA DAISUKE (JP)
ISHIZAKA TADAHIRO (JP)
MOCHIZUKI TAKASHI (JP)
TORIYA DAISUKE (JP)
Application Number:
PCT/JP2018/038157
Publication Date:
June 06, 2019
Filing Date:
October 12, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/458; H01L21/285; H01L21/31; H01L21/683
Foreign References:
| JPH09104986A | 1997-04-22 | |||
| JP2006518930A | 2006-08-17 | |||
| JPH0513558A | 1993-01-22 |
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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