Title:
TREATMENT FLUID
Document Type and Number:
WIPO Patent Application WO/2019/187868
Kind Code:
A1
Abstract:
The present invention provides a treatment fluid for semiconductor devices, the treatment fluid having high temporal stability for residue removal performance, and also having excellent performance for preventing corrosion of a treatment subject. The treatment fluid of the present invention is for semiconductor devices and comprises: at least one hydroxylamine compound selected from the group consisting of a hydroxylamine and a hydroxylamine salt; an organic base compound; an alcohol-based solvent; and a surfactant, wherein the content of the alcohol-based solvent with respect to the total mass of the treatment fluid is 40-85% by mass, and the pH of the treatment fluid is 8 or higher.
Inventors:
KAMIMURA TETSUYA (JP)
TAKAHASHI TOMONORI (JP)
TAKAHASHI TOMONORI (JP)
Application Number:
PCT/JP2019/006981
Publication Date:
October 03, 2019
Filing Date:
February 25, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/304; C11D1/62; C11D3/20; C11D3/26; C11D3/30; C11D3/43; G03F7/42
Domestic Patent References:
| WO2018043440A1 | 2018-03-08 |
Foreign References:
| JP2016090753A | 2016-05-23 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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