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Title:
TREATMENT METHOD AND TEMPLATE FOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/073339
Kind Code:
A1
Abstract:
A treatment method for substrates that carries out prescribed treatment by supplying a treatment liquid to a region to be treated on the substrate surface has: an alignment liquid supply step that supplies an alignment liquid to an alignment region on the substrate surface formed in a position differing from the region to be treated; an alignment step that, thereafter, adjusts the position of a template relative to the substrate with the alignment liquid supplied to the alignment region such that treatment liquid flow paths are positioned over the region to be treated, said template being formed by treatment liquid circulation paths and alignment liquid flow paths passing through in the thickness direction, said treatment liquid circulation paths being positioned facing the substrate and used for circulating the treatment liquid, and said alignment liquid flow path being used for circulating the alignment liquid; and thereafter, a treatment step in which the treatment liquid is supplied to the region to be treated via the treatment liquid flow paths and the prescribed treatment of the substrate is carried out.

Inventors:
IWATSU HARUO (JP)
TOSHIMA TAKAYUKI (JP)
SAKAMOTO KAZUO (JP)
Application Number:
JP2012/077209
Publication Date:
May 23, 2013
Filing Date:
October 22, 2012
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C25D5/02; C23F1/02; C25D7/12; H01L21/288; H01L21/3205; H01L21/60; H01L21/768; H01L23/522
Domestic Patent References:
WO2012050057A12012-04-19
Foreign References:
JP2008280558A2008-11-20
JP2011174140A2011-09-08
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
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