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Patent Searching and Data


Title:
TREATMENT SOLUTION FOR FILM FORMATION
Document Type and Number:
WIPO Patent Application WO/2019/017073
Kind Code:
A1
Abstract:
Provided are a treatment solution and a treatment method which are capable of further improving the corrosion resistance of a metal material. According to the present invention, a chemically converted film is formed on the surface of a metal material, and then a film is formed by using a treatment solution which is for film formation and contains: a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond; an organometallic compound; and water.

Inventors:
KONUMA, Taro (1-10-25, Hanaten-higashi, Tsurumi-ku, Osaka-sh, Osaka 44, 〒5380044, JP)
KAGEHISA, Teruhiko (1-10-25, Hanaten-higashi, Tsurumi-ku, Osaka-sh, Osaka 44, 〒5380044, JP)
NOZAKI, Masafumi (1-10-25, Hanaten-higashi, Tsurumi-ku, Osaka-sh, Osaka 44, 〒5380044, JP)
SHIMAHASHI, Katsumasa (1-10-25, Hanaten-higashi, Tsurumi-ku, Osaka-sh, Osaka 44, 〒5380044, JP)
KATO, Takashi (1-10-25, Hanaten-higashi, Tsurumi-ku, Osaka-sh, Osaka 44, 〒5380044, JP)
Application Number:
JP2018/020267
Publication Date:
January 24, 2019
Filing Date:
May 28, 2018
Export Citation:
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Assignee:
OKUNO CHEMICAL INDUSTRIES CO., LTD. (4-7-10, Doshomachi Chuo-ku, Osaka-sh, Osaka 45, 〒5410045, JP)
International Classes:
C23C26/00; C09D5/08; C09D7/63; C09D183/04; C23C22/68; C23F11/173
Foreign References:
JP2015134942A2015-07-27
US5326594A1994-07-05
JP2007277690A2007-10-25
JP2009190369A2009-08-27
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (Kitahama TNK Building, 1-7-1 Doshomachi, Chuo-ku, Osaka-sh, Osaka 45, 〒5410045, JP)
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