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Patent Searching and Data


Title:
TREATMENT SOLUTION FOR FILM FORMATION
Document Type and Number:
WIPO Patent Application WO/2019/017073
Kind Code:
A1
Abstract:
Provided are a treatment solution and a treatment method which are capable of further improving the corrosion resistance of a metal material. According to the present invention, a chemically converted film is formed on the surface of a metal material, and then a film is formed by using a treatment solution which is for film formation and contains: a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond; an organometallic compound; and water.

Inventors:
KONUMA TARO (JP)
KAGEHISA TERUHIKO (JP)
NOZAKI MASAFUMI (JP)
SHIMAHASHI KATSUMASA (JP)
KATO TAKASHI (JP)
Application Number:
JP2018/020267
Publication Date:
January 24, 2019
Filing Date:
May 28, 2018
Export Citation:
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Assignee:
OKUNO CHEM IND CO (JP)
International Classes:
C23C26/00; C09D5/08; C09D7/63; C09D183/04; C23C22/68; C23F11/173
Foreign References:
JP2015134942A2015-07-27
US5326594A1994-07-05
JP2007277690A2007-10-25
JP2009190369A2009-08-27
JP2007277690A2007-10-25
JP2012036469A2012-02-23
JP2014101585A2014-06-05
JP2002371380A2002-12-26
JP2015134942A2015-07-27
JP2017008338A2017-01-12
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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