Title:
TSV MEASURING APPARATUS AND TSV MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/157882
Kind Code:
A1
Abstract:
Disclosed are a TSV measuring apparatus and a TSV measuring method for measuring a via hole such as a TSV. The TSV measuring apparatus, for measuring a TSV formed on an object being measured, comprises: a light source; a digital variable aperture, provided on a path of light irradiated from the light source, for adjusting a light-irradiating area of the light irradiated from the light source according to an aspect ratio of the TSV; a beam splitter for outputting the light having passed through the digital variable aperture by splitting the light into the first direction and the second direction perpendicular to each other, and outputting a combined light by combining a first reflected light, which is reflected from the object being measured disposed in the first direction, and a second reflected light, which is reflected from a mirror disposed in the second direction; and a detector for measuring the TSV by using the combined light guided from the beam splitter, wherein the digital variable aperture performs a function of apertures having selectively different diameters according to the aspect ratio of the TSV without physical movement.
Inventors:
HWANG YOUNG MIN (KR)
KIM SEONG RYONG (KR)
JO TAE YOUNG (KR)
KIM SEONG RYONG (KR)
JO TAE YOUNG (KR)
Application Number:
PCT/KR2014/002434
Publication Date:
October 02, 2014
Filing Date:
March 24, 2014
Export Citation:
Assignee:
SNU PRECISION CO LTD (KR)
International Classes:
G01N21/88; H01L21/66
Foreign References:
| KR20130012412A | 2013-02-04 | |||
| KR101186464B1 | 2012-09-27 | |||
| US5450201A | 1995-09-12 | |||
| US20120197592A1 | 2012-08-02 | |||
| KR20100096199A | 2010-09-01 |
Attorney, Agent or Firm:
KIM, TAE WAN (KR)
κΉνμ (KR)
κΉνμ (KR)
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