TUBE BONDER - TERUMO CORP

Title:

TUBE BONDER

Document Type and Number:

WIPO Patent Application WO/2004/039563

Kind Code:

A1

Abstract:

A tube bonder capable of performing temperature control of a wafer stably and accurately even when a tube is bonded continuously. The tube bonder (1) comprises a heater (70) for heating a wafer holding section (5a), a thermistor (71) detecting the temperature at the wafer holding section (5a), a means (69) performing heating control of the heater (70) based on the output from the thermistor (71), and a means (68) for performing heating control of the wafer (6) through constant power control. Before heating control of the wafer (6) is started by the wafer heating control means (68), heating control of the heater (70) is performed by the heating control means (69) of the heater and the temperature at the wafer holding section (5a) is controlled to a constant level (about 65&ring C).

Inventors:

SANO HIROAKI (JP)
NAGASHIMADA MASARU (JP)
ISHIDA SHINJI (JP)

Application Number:

PCT/JP2003/011860

Publication Date:

May 13, 2004

Filing Date:

September 17, 2003

Export Citation:

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Assignee:

TERUMO CORP (JP)
SANO HIROAKI (JP)
NAGASHIMADA MASARU (JP)
ISHIDA SHINJI (JP)

International Classes:

A61M1/28; G01R29/08; A61M1/14; A61M39/14; B29C65/00; B29C65/02; B29C65/20; G06F17/50; (IPC1-7): B29C65/74; B29C65/20; A61M1/14

Foreign References:

JPH0691010A	1994-04-05
EP0778123A2	1997-06-11
EP0101315A2	1984-02-22
JPH0678971A	1994-03-22
JPH11178889A	1999-07-06
EP0105587A1	1984-04-18
JPH0691009A	1994-04-05

Other References: