Title:
TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/116715
Kind Code:
A1
Abstract:
The present invention relates to the technical field of high-performance metal materials and advanced electronic interconnection electroplating, and provides a twin crystal copper material and a hybrid bonding structure. The twin crystal copper material has a (110) crystal face preferred orientation, the twin crystal copper material comprises a twin crystal structure, the twin crystal structure comprises a twin crystal plate layer, and the twin crystal plate layer is mainly distributed at an included angle of 45° with the crystal grain growth direction; the proportion of crystal grains of the twin crystal plate layer in the total number of crystal grains of the twin crystal copper material is greater than or equal to 50%, and/or the ratio of the volume of the twin crystal structure to the total volume of the twin crystal copper material is greater than or equal to 50%. The twin crystal copper material provided by the present invention is an annealing twin crystal copper having a (110) crystal face preferred orientation, wherein a high proportion of twin crystal boundaries are stably present. Compared with an electroplating micron twin crystal copper having a (110) crystal face height preferred orientation, the twin crystal copper material has more excellent structural thermal stability, there is no crystal grain abnormally grown in a common heat treatment temperature range (such as 200ºC to 400ºC) in the field of electronic materials, and the unique property that the proportion of the twin crystal plate layer is not decreased but increased is shown.
Inventors:
LIU ZHI-QUAN (CN)
LI ZHE (CN)
LI XIAO (CN)
GAO LI-YIN (CN)
SUN RONG (CN)
LI ZHE (CN)
LI XIAO (CN)
GAO LI-YIN (CN)
SUN RONG (CN)
Application Number:
PCT/CN2022/140433
Publication Date:
June 29, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C25D3/38; C25C1/12; C25D5/50; C25D7/12; H01L21/60; H01L21/603; H01L23/488; H01L23/52; H05K3/10
Foreign References:
| CN114086224A | 2022-02-25 | |||
| CN114220783A | 2022-03-22 | |||
| CN1357157A | 2002-07-03 | |||
| CN110724981A | 2020-01-24 | |||
| CN110607550A | 2019-12-24 | |||
| US20210020599A1 | 2021-01-21 |
Attorney, Agent or Firm:
BEIJING CHENGHUI LAW FIRM (CN)
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