TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE AND METHOD FOR MANUFACTURING THE TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE

WIPO Patent Application WO/2004/092452

A1

A two layer flexible copper-clad laminate which is manufactured by the direct metallization method and has a polyimide resin film base material, a seed layer formed on one surface of the base material, and a copper layer formed on the seed layer, characterized in that the seed layer comprises a) a nickel based thin film having an average thickness of 50 nm to 700 nm, b) an amorphous cobalt film having an amorphous layer of an average thickness of 10 to 80 nm, C) a mixture layer which comprises cobalt particles and/or cobalt oxide particles and a polyimide resin and has an average thickness of 50 to 180 nm, and those films and layer are laminated. The above two-layer flexible copper-clad laminate manufactured by the direct metallization method contains none of substances to be avoided, such as chromium, in its seed layer.

YOKOTA TOSHIKO (JP)
TAKAHASHI SUSUMU (JP)
MATSUSHIMA HIDEAKI (JP)
DOBASHI MAKOTO (JP)
ISHII MASAHITO (JP)

PCT/JP2004/005259

October 28, 2004

April 13, 2004

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MITSUI MINING & SMELTING CO (JP)
YOKOTA TOSHIKO (JP)
TAKAHASHI SUSUMU (JP)
MATSUSHIMA HIDEAKI (JP)
DOBASHI MAKOTO (JP)
ISHII MASAHITO (JP)

H05K1/09; B32B15/08; B32B15/088; C23C18/16; C23C18/20; C23C18/34; C23C18/52; C25D5/56; C25D7/00; H05K3/38; (IPC1-7): C25D5/56; B32B15/08; C23C18/16; C25D7/00; H01L21/60

JP2003239082A	2003-08-27
JPH08330693A	1996-12-13

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama, JP)

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