TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE SUBSTRATE AND PROCESS FOR PRODUCING SAME

Title:

TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE SUBSTRATE AND PROCESS FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2010/067854

Kind Code:

A1

Abstract:

A process for producing a two-layer flexible copper-clad laminate substrate by wet plating using an acidic copper plating bath composition and a resin film coated with a conductive metal serving as a seed layer. The process for two-layer FCCL production includes: a step in which a seed layer is formed by electroless nickel plating on a hydrophilized surface of a resin film; and a step in which this resin film is subjected, without performing primary copper plating, to wet electroplating in the acidic copper plating bath composition to thickly deposit a conductive copper layer on the seed layer.

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Inventors:

OHNO AKINOBU (JP)
KOHTOKU MAKOTO (JP)
HAMADA MIKA (JP)

Application Number:

PCT/JP2009/070720

Publication Date:

June 17, 2010

Filing Date:

December 04, 2009

Export Citation:

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Assignee:

EBARA UDYLITE KK (JP)
OHNO AKINOBU (JP)
KOHTOKU MAKOTO (JP)
HAMADA MIKA (JP)

International Classes:

C23C18/18; C25D3/38; C25D7/00

Foreign References:

JP2008231459A	2008-10-02
JP2008063624A	2008-03-21

Attorney, Agent or Firm:

NAKAMURA, SHIZUO (JP)
Shizuo Nakamura (JP)

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