Title:
TWO-PACKAGE CURABLE SOLVENT-FREE ADHESIVE FOR LAMINATES AND RESIN CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2017/142008
Kind Code:
A1
Abstract:
This two-package curable solvent-free adhesive for laminates contains a polyisocyanate component and a polyol component. The polyisocyanate component contains a derivative of pentamethylene diisocyanate; the derivative of pentamethylene diisocyanate contains an isocyanurate group and an allophanate group; and the content ratio of isocyanurate groups is from 60 moles to 99 moles (inclusive) relative to 100 moles of the total of isocyanurate groups and allophanate groups.
Inventors:
NAKAGAWA JYUNICHI (JP)
IMAI AKIHIRO (JP)
ANDO KAZUHIRO (JP)
NAKAGAWA TOSHIHIKO (JP)
MORITA HIROKAZU (JP)
YAMASAKI SATOSHI (JP)
IMAI AKIHIRO (JP)
ANDO KAZUHIRO (JP)
NAKAGAWA TOSHIHIKO (JP)
MORITA HIROKAZU (JP)
YAMASAKI SATOSHI (JP)
Application Number:
PCT/JP2017/005657
Publication Date:
August 24, 2017
Filing Date:
February 16, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09J175/04
Domestic Patent References:
| WO2012121291A1 | 2012-09-13 |
Foreign References:
| JP2010059362A | 2010-03-18 | |||
| JP2011162656A | 2011-08-25 | |||
| JP2010059362A | 2010-03-18 | |||
| JPS61129173A | 1986-06-17 |
Other References:
See also references of EP 3418343A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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