Title:
TWO-PART CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/215522
Kind Code:
A1
Abstract:
The present invention provides a two-part curable resin composition that, while maintaining the adhesive strength with respect to metals, can provide a cured product having high strength and high elongation. Provided is a two-part curable resin composition comprising agent A and agent B. Agent A: A composition containing component (a), which includes (a-1) a hydrogenated epoxy resin and (a-2) a bisphenol-type epoxy resin, and component (b), which is a curing catalyst for component (c).
Agent B: A composition containing component (c), which is an organic polymer having two or more hydrolysable silyl groups, and component (d), which is a curing agent for component (a).
Inventors:
SOGA TETSUNORI (JP)
SHIMOKAWA EIJI (JP)
SHIMOKAWA EIJI (JP)
Application Number:
PCT/JP2022/013417
Publication Date:
October 13, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J11/06; C08K5/17; C08K5/54; C08L63/00; C08L101/10; C09J11/08; C09J163/00
Domestic Patent References:
| WO2014017218A1 | 2014-01-30 |
Foreign References:
| JP2009270069A | 2009-11-19 | |||
| JP2015003950A | 2015-01-08 | |||
| JP2011001492A | 2011-01-06 | |||
| JP2007099806A | 2007-04-19 | |||
| JP2021065804A | 2021-04-30 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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