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Patent Searching and Data


Title:
TWO-SIDE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/208968
Kind Code:
A1
Abstract:
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended state.

Inventors:
TANAKA YUKI (JP)
MARUTA MASASHI (JP)
Application Number:
PCT/JP2020/007912
Publication Date:
October 15, 2020
Filing Date:
February 27, 2020
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
FUJIKOSHI MACHINERY CORP (JP)
International Classes:
B24B37/005; B24B37/08; B24B37/12; B24B37/14; H01L21/304
Foreign References:
JPH04217456A1992-08-07
JP2000225563A2000-08-15
JPH09309064A1997-12-02
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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