A TWO SUBSTRATE PARALLEL OPTICAL SUB -ASSEMBLY

RELATED APPLICATIONS

[0001] The present application claims priority under 35 USC§ 120 of US Patent Application bearing serial number 11/862,594, filed on September 27, 2007, the contents of which are hereby incorporated by reference. This application is related to US patent 7,178,235 granted February 20, 2007 entitled METHOD OF MANUFACTURING AN OPTOELECTRONIC PACKAGE and US patent 7,197,224 granted March 27, 2007 entitled OPTICAL FERRULE, the specifications of which are hereby incorporated by reference.

FIELD OF THE ART

[0002] This description pertains to the field of precision alignment of multiple devices. More precisely, it relates to the field of optical alignment of three or more elements.

BACKGROUND

[0003] There has been much work devoted to the alignment of lasers (or photodetectors) with optical fibers to provide for the maximum amount of coupling and subsequent transmission of light along an optical fiber. Most products are based on a single laser aligned to a single optical fiber - an example is the SFP optical transceiver, with a well aligned transmitter module and a well aligned receiver module; each with a single optical fiber coupling in an LC connector housing.

[0004] However, due to ever growing demands for bandwidth in smaller overall volumes of space (known as a higher bandwidth- density) there has been an increasing trend towards parallel optical modules where multiple lasers are aligned to multiple

optical fibers in a single module - an example of this is the SNAP- 12 parallel optical transceiver with 12 optical channels in an area roughly 1-cm x 1-cm. Both single and multiple optical channel modules require well positioned and well toleranced subcomponents and holders. Furthermore, they are usually aligned while actively monitoring the optical power levels, to or from the optical fiber, to ensure the highest possible coupling (lowest insertion loss) . The alignment between the multiple lasers and the optical fibers is time consuming, requires a complicated set of parallel holders and relay optics, such as a patterned microlens array and an MT-style optical ferrule, precision pick-and-place techniques, and also requires the lasers to be powered-on for active alignment.

[0005] Therefore there is a need for an easier and faster alignment method.

SUMMARY

[0006] There is described herein a method and apparatus for the alignment of two or more optical devices with a single structure containing multiple optical waveguides or optical fibers. This relates to the optical coupling of light that requires multiple optical coupling operations to micron (or sub- micron) tolerance levels to produce an optical sub-assembly comprised of both input and output electrical signals and input and output optical signals for bi-directional optical components .

[0007] There is described concepts that are directed towards the manufacturability of volume quantities of bi-directional optical sub-assemblies. This assembly provides for a low- profile, robust sub-component that can be used in a variety of

optical modules. Furthermore, the methods described to construct the sub-component allow for low-cost manufacturing.

[0008] There is described a means for bi-directional optical data communications using at least 2 optical channels and comprising at least one light emitting device on a chip that has been mounted on an electrical interconnecting substrate, at least one light detecting device on a chip that has been mounted on an electrical interconnecting substrate, and an optical guiding structure that holds at least two optical channels, where at least one optical channel is for output optical signals and the other is for input optical signals. Structures that contain multiple pathways for light, such as a polymer waveguides or a structure that contains a lens array can also be envisioned.

[0009] Several optical alignment aspects are involved when aligning three (or more) independent objects, especially when each component involves more than 1 optical channel, without the use of expensive pick-and-place equipment.

[0010] Each optoelectronic chip, the emitter chip and the detector chip, is aligned to the optical guiding structure independently from the other. Once all fixed together, the final assembly can then be mounted on a common carrier (typically a printed circuit board) and connected electrically. In this way, the very precise mechanical placement of very small devices, such as the optoelectronic chips, can be eliminated and thus the cost can be reduced as well as the time required. The vertical spacing of the active area of the emitter array to the optical interface of the optical guiding structure can be different from the vertical distance between the active area of the detector array and the optical interface of the same optical guiding

structure. The electrical connections (such as wirebonds) between the optoelectronic arrayed devices and their respective substrates can tolerate a large variation in ideal position as does the electrical connection between the completed optical assembly and the common carrier. The type of optical alignments proposed combined with the positional flexibility of the electrical connections to the conductive trace lines eliminate the need for precision pick-and-place equipment and speed up assembly time.

[0011] In accordance with a first broad aspect, there is provided a method for assembling components of an optical assembly, the method comprising: providing a structure for guiding light having a top surface and a bottom surface, and comprising a plurality of grooves on the bottom surface; providing a plurality of optical waveguides, each being embedded in a corresponding one of the plurality of grooves, and having a coupling surface at one end; attaching a first array of first optical components to a first substrate; attaching a second array of second optical components to a second substrate independently of a position of the first array of first optical components on the first substrate; positioning the first substrate such that the first array of first optical components is substantially aligned in a one-to-one manner with the coupling surface for a first group of optical waveguides amongst the plurality of optical waveguides; attaching the first substrate to the structure; positioning the second substrate such that the second array of second optical components is substantially aligned in a one-to-one manner with the coupling surface for a second group of optical waveguides amongst the plurality of optical waveguides, the first substrate and the second substrate being spaced apart to form a gap, the gap

allowing a position of the second array of second optical components on the second substrate to be independent of the position of the first array of first optical components on the first substrate; and attaching the second substrate to the structure .

[0012] In accordance with a second broad aspect, there is provided an optical assembly comprising: a structure for guiding light having a top surface and a bottom surface, and comprising a plurality of grooves on the bottom surface; a plurality of optical waveguides, each being embedded in a corresponding one of the plurality of grooves, and having a coupling surface at one end; and at least two substrates, each comprising an array of optical components attached thereto, the array of optical components being substantially aligned in a one-to-one manner with the coupling surface for a corresponding group of optical waveguides amongst the plurality of optical waveguides, the at least two substrates being spaced apart to form at least one gap, the at least one gap having a non-constant width along a length thereof in order to allow the array of optical components for each one of the at least two substrates to be aligned with the coupling surface for the corresponding group of optical waveguides .

[0013] In accordance with a third broad aspect, there is provided an optical assembly comprising: a structure for guiding light having a top surface and a bottom surface and comprising a plurality of V-grooves on the bottom surface, the V-grooves extending from a first structure end to a second structure end, one of the first structure end and the second structure end being a beveled structure end; a plurality of optical fibers, each being embedded in a corresponding one of the plurality of

V-grooves and having a beveled surface at one end and a coupling surface adjacent to the beveled surface, the beveled surface and the beveled structure end being positioned in a flush relationship; a first substrate comprising an array of light emitters attached thereto, the light emitters being substantially aligned with the coupling surface for a first group of optical fibers of the plurality of optical fibers in a one-to-one manner; and a second substrate comprising an array of light detectors attached thereto, the light detectors being substantially aligned with the coupling surface for a second group of optical fibers of the plurality of optical fibers in a one-to-one manner, the first substrate and the second substrate being fixedly attached to the structure, the first substrate and the second substrate being spaced apart to form a gap, the gap having a non-constant width along a length thereof in order to allow the array of light emitters to be aligned with the coupling surface for the first group of optical fibers in a one- to-one manner and the array of light detectors to be aligned with the coupling surface for the second group of optical fibers in a one-to-one manner.

[0014] The term "substrate" is used to define any piece of material on which optical components may be attached. The surface area of the substrate is larger than that of the optical components. While the optical components require precision pick- and-place equipment to be manipulated because of their small dimensions, a substrate can be manipulated by hand. As a result, if an optical component is attached to the substrate, the optical component may be manipulated by hand by manipulating the substrate .

DESCRIPTION OF THE DRAWINGS

[0015] Fig. Ola is a perspective view of a two-substrate parallel optical sub-assembly in accordance with an embodiment described herein;

[0016] Fig. 01b is an enlarged view of the two-substrate parallel optical sub-assembly of Fig. 01a showing the optoelectronic chips and the optical coupling mechanism;

[0017] Fig. 02a is a top view of the alumina substrate of Fig. 01a and Fig. 01b, for a light emitting chip, with the maximum allowable positional tolerance of the chip on the substrate being indicated;

[0018] Fig. 02b is a top view of the alumina substrate of Fig. 01a, and Fig. 01b, for a light detecting chip, with the maximum allowable positional tolerance of the chip on the substrate being indicated;

[0019] Fig. 03 is a top view of an ideal position of the light emitting chip with respect to the light detecting chip of Fig. 05a and Fig. 05b, on their respective alumina substrates;

[0020] Fig. 04a is a top view of the two-substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, with the substrates and the optical ferrule being perfectly aligned and positioned;

[0021] Fig. 04b is a top view of the two-substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, with the substrates and the optical ferrule being aligned but not perfectly positioned;

[0022] Fig. 05a is a top view of the two-substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, with the substrates having an alternative shape;

[0023] Fig. 05b illustrates the coupling of light emitted by a laser into an optical fiber of the guiding structure when the laser is located below the optical fiber, in accordance with an embodiment ;

[0024] Fig. 05c illustrates the coupling of light from an optical fiber of the guiding structure into a photodetector when the photodetector is located below the optical fiber, in accordance with an embodiment;

[0025] Fig. 05d illustrates the coupling of light emitted by a laser into an optical fiber of the guiding structure when the laser is aligned with the optical fiber, in accordance with an embodiment ;

[0026] Fig. 06 is a front cross-sectional view of the two- substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, with the vertical height differences between the two substrates and the optical ferrule being shown;

[0027] Fig. 07 is a perspective view of the two-substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, in an unassembled stage wherein the light emitting apertures are to be aligned with the ends of the optical fibers of the optical ferrule; and

[0028] Fig. 08 is a perspective view of the two-substrate parallel optical sub-assembly of Fig. 01a and Fig. 01b, in an unassembled stage wherein the light detecting apertures are to

be aligned with the ends of the optical fibers of the optical ferrule .

DETAILED DESCRIPTION

[0029] In one embodiment, a two substrate parallel optical sub-assembly is described that incorporates a laser array optoelectronic chip, a photodetector array optoelectronic chip and a means for coupling multiple light channels to and from each chip through a coupling side of the structure.

[0030] The two substrate parallel optical sub-assembly uses a single optical guiding structure composed of an arrangement of multiple, fixed, well-aligned or parallel optical guiding channels (or optical fibers) which may be embedded in the structure. The arrangement of the optical fibers in the structure may vary.

[0031] The optical guiding structure typically has a single "external" optical interface - like the multi-terminal (MT) style of parallel optical connector - to maintain a high bandwidth-density ratio.

[0032] Fig. 01a shows an example of a two-substrate parallel optical sub-assembly, herein simply referred to as an optical assembly. The optical assembly has an optical guiding structure having an optical ferrule. The ferrule is composed of an MT- style optical connector [01] with two dowel pins [03] (only shown in Fig. 01a) , a short optical fiber ribbon section [05] , and silicon v-groove structure [07] . The structure 07 has a coupling side from which light is coupled. The structure also holds the beveled tips (or ends) [21] of the embedded optical fibers in place along the coupling side and such that a coupling surface of each of the optical fibers is substantially adjacent

to a beveled side of the structure. Each optoelectronic device, the VCSEL array [09] and the photodetector array [11] , are attached to their own respective alumina substrates [13] and

[15] , and wirebonded to gold trace line electrical conductors

[17] and [19] .

[0033] Referring to Fig. 01b, in this embodiment, the optical ferrule used has 12 aligned, parallel optical fibers [05] that have 45-degree beveled end tips [21] that are all co-linear and on a pitch of 0.25-mm, a close-up view of the tips of the optical fibers is shown in Fig. 01b.

[0034] Referring to both Fig. 01a and 01b, the other end of the optical ferrule is compatible with a single multi-terminal optical connector [01] called an MT ferrule. In this case, only eight of the twelve optical channels are used - there are four transmitter channels (optical fibers) , four unused channels

(optical fibers) in the middle, and four receiver channels

(optical fibers) . The unused set of optical fibers is used as a separation (also referred to as a gap having a gap length) [23] between the transmitter and receiver groups of optical fibers to provide for some alignment clearances for the two alumina substrates. The two groups of optical fibers within the optical guiding structure are fixed in-place, with a fixed separation

[23] defining a gap.

[0035] Each alumina substrate has an optoelectronic chip fixed to its surface - a light emitting chip, the VCSEL array [09] and a light detecting chip, namely the photodetecting chip [11] . However, other combinations of emitter-emitter or detector-detector chips, especially for different wavelengths, can also be envisioned. The substrates are to be designed so that they can be individually handled and not obstruct each

other during optical alignment. In this particular embodiment, the alumina substrates have been designed to be long and narrow with the optoelectronic chips placed near either edge of each substrate .

[0036] The allowable positional and rotational tolerance of the optoelectronic chip on the substrate depends on the overall sizes and shapes of all the sub-components of the assembly. In this particular embodiment, the substrates are mirror images of each other, as in Fig. 02a and Fig. 02b. The nominal positional and rotational tolerance of each optoelectronic chip on their respective substrate is indicated in Fig. 03 by the dashed ovals

[25] and [27] placed around each chip, the VCSEL chip [09] and a photodetecting chip [11], respectively.

[0037] In this particular case, one substrate contains a 1x4 VCSEL laser array that is 1-mm x 0.3-mm in footprint and is placed near one edge of its respective alumina substrate and is wirebonded to the gold traces (wirebonds are not shown) . The other substrate contains a 1x4 PD array that is 1-mm x 0.3-mm in area and is placed near one edge of its respective alumina substrate and is wirebonded to the gold traces (wirebonds are not shown) . Both optoelectronic chips [9] and [11] are placed on the edges of their respective alumina substrates [13] and [15] such that they are adjacent to one another and form a mirror- image pattern.

[0038] Still as shown in Fig. 03, the centers of the active areas of the VCSEL chip [9] and the photodetector chip [11] lie along the dashed horizontal line [29] - it is noted that aligning the sides of the optoelectronic chips may not in fact align the centers of the active areas. Most dice cuts along semiconductor chips have tolerances of more than +/- 25 -microns,

so the sides of the chips may not be sufficient to align the active areas properly with respect to one another.

[0039] A second alignment consideration is that of the pitch between the devices. The twelve vertical dashed lines [31] indicate a pitch of 0.25 -mm between the centers of adjacent active areas for both chips. The dashed lines [31] continue in the space (also referred to as a gap) section [23] between the two independent substrates, as shown in Fig. 03. The pitch is also referred to as a distance between the centers of the active areas along the dashed horizontal line [29] . Hence, the gap length along the line [29] is greater than the distance between the centers of the active areas along the line [29] .

[0040] As an example, given an optical ferrule that is 7 -mm x 7 -mm in area, where the twelve optical fibers are parallel and vertically centered in the optical ferrule with a pitch of 0.25- mm, the gap between the two outer groups of four optical fibers is 1.125 -mm. Given that the length (L) of each alumina substrate is 10 -mm, it can be calculated that the positional tolerance of both the VCSEL [9] and PD arrays [11] with respect to their ideal positions is roughly +/- 0.3 -mm in both x and y and have a rotational tolerance of +/- 2-degrees.

[0041] Therefore, when the optoelectronic chips are well- aligned to the optical fibers [05] in the v-groove structure

[07] of the optical ferrule, and they have also been well aligned to their substrate [13] or [15] , the orientation as shown in Fig. 04a is obtained.

[0042] If the optoelectronic chips are placed with low positional and rotational accuracy on their substrate (but within the dashed oval boundaries [25] and [27] shown in Fig.

06), once the active areas of each chip [9] or [11] are aligned to the optical fibers of the optical ferrule, the orientation shown in Fig. 04b is obtained. In this case, the gap [23] between the substrates [13] and [15] has a non-constant width along its length. The gap [23] allows the active areas of each chip [9] or [11] to be aligned with the optical fibers while the substrates [13] and [15] are not parallel.

[0043] In one embodiment, the alumina substrates [13] and [15] will only just touch at one corner [33] . This relatively large placement tolerance therefore allows the optoelectronic devices [9] and [11] to be placed without the use of high- precision pick-and-place equipment and reduces the cost and time of the assembly.

[0044] Other geometries for alumina substrates [13] and [15] exist. There are trade-offs between their manufacturability and their ease of alignment however. A specific example of another geometry would be to use substrates with protruding vertices

[35] , as shown in Fig. 05a, where the optoelectronic chips would be placed near the vertex of their substrate [13] or [15] . This would lead to a greater tolerance to positional and rotational alignment of the two substrates (since the substrates would be much less likely to interfere with one another) . Such substrate geometry could however be more difficult to manufacture. Other examples of substrate shapes and related trade-offs are also possible.

[0045] Figures 05b, 05c and 05d illustrate the coupling of light between an optoelectronic device and an optical waveguide of the structure [07] , in accordance with an embodiment. In figure 05b, a laser [52] of the array [09] is located under an optical waveguide [21] , such as an optical fiber, embedded into

the structure [07] . The laser [52] is positioned under the beveled surface of [54] of the optical fiber [21] . Light emitted by the laser [52] passes though the side of the optical fiber, through the cladding, and reflects off the beveled tip, due to reflection, into the core of the optical fiber. The region [22] of the side surface of the optical fiber [21] which is located below the beveled surface [54] defines a coupling surface by which light enters into the fiber before being reflected by the beveled surface [54] . In one embodiment, the center of the active area of the laser [52] is substantially positioned under the center of the beveled surface [54] of the optical fiber in order to improve the coupling of light into the fiber [21] .

[0046] In one embodiment, the beveled surface is at 45- degrees to create a reflective glass-air interface at the fiber tip [54] . This interface can reflect light at 90-degrees by either total internal reflection (TIR) when the glass-air interface is preserved, or by depositing a reflective metal layer on the exposed tips of the fiber. The reflective metal layer may be made of gold, silver, and the like.

[0047] Figure 05c illustrates the coupling of light from the optical fiber [21] into a photodetector [56] of the photodetector array [11] . The photodetector [56] is positioned under the beveled surface [54] of the optical fiber [21] . Light propagating into the optical fiber [21] towards the beveled surface [54] reflects off the beveled surface [54] , due to TIR or the metallic surface, and is directed normal to the axis of optical fiber [21] . Light passes through the cladding and out of the side of the optical fiber [21] by the coupling region [22] and is collected by the photodetector [56] . In one embodiment, the center of the active area of the photodetector [56] is

substantially positioned under the center of the beveled surface [54] of the optical fiber [21] in order to improve the coupling of light into the photodetector [56] .

[0048] It should be noted that when the optical waveguide is an optical fiber [21] , the curvature of the optical fiber [21] creates a lensing effect which aids in the coupling of light. However, a lensing system may be added between the optical waveguides and the optoelectronic devices in order to improve the coupling of light.

[0049] Figure 05d illustrates the coupling of light emitted by the laser [52] when the laser [52] is aligned with the end

[58] of the optical fiber [21] . In this embodiment, the end [58] is cut at a substantially right angle and corresponds to the coupling surface of the optical fiber [21] by which light emitted by the laser [52] is coupled into the optical fiber

[21] .

[0050] Referring to Fig. 06, in addition to the positional and rotational placement of the optoelectronic chips [09] and

[11] on their respective alumina substrates [13] and [15] , the vertical height above the optoelectronic chip can be calibrated using a precision spacer (also referred to as a spacing device)

[39] or [41] fixed to any of the substrates [13] or [15] . It should be understood that the spacer [39] and [41] may be part of the substrates [13] and [15], respectively.

[0051] Different heights of emitter and detector optoelectronic chips can be accommodated by using different thicknesses for the spacers. A spacer can be made of glass or any other low-expansion precision cut material. The spacer can

also accommodate differing optimal divergence conditions or lensing system requirements.

[0052] For example, Fig. 06 shows a front side view of the two substrate optical sub-assembly of Fig. 04a and Fig. 04b in a highly magnified but proportional view of the space (or gap)

[23] and the two adjacent wirebonded [37] optoelectronic chips

[9] and [11] . Assuming a 1x4 VCSEL array chip [09] which is 200- microns thick and requires a distance [44] of 132.5-microns between the laser aperture (or the active area of the lasing element on the chip [9] ) and the centre of the optical fiber, a precision spacer of 280-microns [39] is used.

[0053] With a 1x4 photodetector array [11] which is 150- microns thick and requires a distance [46] of 102.5-microns between the active area of the detector element and the centre of the optical fiber, a precision spacer of 190-microns [41] is used.

[0054] Although a small vertical height difference [43] between the two substrates [13] and [15] may occur, these small differences can be handled in a variety of ways to maintain electrical and mechanical connections, such as different substrate thicknesses or the use of different amounts of epoxy and/or longer or shorter wirebonds or electrical connections between the chips and their substrates [37] .

Alignment procedure:

[0055] Where the optical guiding structure has the optical ferrule as described hereinabove, and when the useful channels of the optical ferrule are the four left-most optical fibers and the four right-most optical fibers, with the four middle optical fibers being left unused, the alignment of the three parts (the

optical ferrule with the two packages each comprising an optoelectronic device, a substrate and an optional spacer) are as follows:

[0056] A wirebonded 1x4 VCSEL array chip [9] is attached to a first substrate [13] and a wirebonded 1x4 Photodetector array- chip [11] is attached to a second alumina substrate [15] . The position of the array chip [11] on the second substrate [15] is independent of the position of the array chip [9] on the first substrate [13] .

[0057] The first alumina substrate [13] carrying the wirebonded 1x4 VCSEL array chip [9] is aligned using a vision system so that the centers of each active area of each VCSEL are substantially centered with the centers of the four optical fiber cores on one side of the body of the optical ferrule, as shown in Fig. 07.

[0058] The optical fibers embedded in the ferrule [07] are divided into three groups. A first group of four optical fibers is associated with the four VCSELs, a second group is associated with the gap, and a third group is associated with the four photodetectors .

[0059] In one embodiment, the above alignment is done by holding the first alumina substrate [13] fixed in place while manipulating the body of the optical ferrule [07] . By moving the ferrule [07] along the x and y axis and rotating the ferrule

[07] around the z axis, it is possible to align the four optical fibers with the four VCSELs as indicated by the dashed arrows

[45] . As a result, each VCSEL is positioned under the beveled surface [21] of a corresponding optical fiber of the first group. The alignment of the beveled surface [21] of the optical

fibers with the VCSELs is performed visually by a user of the alignment method while the VCSELs are un-powered. In one embodiment, the active area of each VCSEL is substantially positioned under the center of its corresponding optical fiber.

[0060] While the present description refers to holding the first alumina substrate [13] fixed in place while manipulating the body of the optical ferrule [07] , a person skilled in the art understands that the reverse is also possible. In this case, the body of the optical ferrule [07] is held in place while manipulating the first alumina substrate [13] .

[0061] In one embodiment, a vision system such as a microscope, for example, may be used to perform the alignment. The vision system can be any system permitting a visual, un- powered alignment. Hence, there is no need to use passive mechanical stops or location borders. Such a system also avoids using a "blind" search for a maximal optical power to perform the alignment.

[0062] Once the VCSELs have been positioned to face the beveled surface [21] of their corresponding optical fiber [21] , the structure [07] is attached to the substrate [13] . Any mechanical means known to a person skilled in the art may be used to fixedly attached the substrate [13] and the structure

[07] together.

[0063] In one embodiment of the method, a spacer [39] is provided and positioned between the substrate [13] and the structure [07] . During the alignment procedure of the VCSELs with corresponding optical fibers, abutting the spacer [39] on the structure [07] and resting on the spacer [39] restricts the overall movement of the optical ferrule to only about 3 degrees

of motion during an alignment which is performed by manipulating the optical ferrule using, for example, a vacuum chuck. The first substrate [13] is then epoxy cured in place to the optical ferrule, as indicated by the black material [47] in Fig. 11.

[0064] Still referring to Fig. 11, the second alumina substrate [15] carrying the wirebonded 1x4 Photodetector array chip [11] is then held fixedly in place while the assembly of the optical ferrule with the first substrate [13] is manipulated as indicated by the dashed arrows [49] . By moving the ferrule

[07] with the first substrate [13] along the x and y axis and rotating the ferrule [07] around the z axis, it is possible to align the four optical fibers with the four photodetectors . As result, each photodetector of the array [11] is positioned under the beveled surface [21] of a corresponding optical fiber of the third group. The alignment of the beveled surface [21] of the optical fibers with the VCSELs is performed visually by a user of the alignment method while the VCSELs are un-powered. In one embodiment, the active area of each photodetector is substantially positioned under the center of its corresponding optical fiber.

[0065] It should be understood that the optical ferrule with the first substrate [13] may be held in place instead of the alumina substrate [15] . In this case, the alumina substrate [15] is manipulated in order to align the photodetectors with their corresponding optical fibers.

[0066] Once the photodetectors have been positioned to face the beveled surface [54] of their corresponding optical fiber

[21] , the structure [07] is attached to the substrate [15] . Any mechanical means known to a person skilled in the art may be

used to fixedly attach the substrate [15] and the structure [07] together .

[0067] In one embodiment of the method, a spacer [41] is provided and positioned between the second substrate [15] and the structure [07] . During the alignment procedure of the photodetectors with the corresponding optical fibers, resting on the spacer [41] restricts the overall movement of the optical ferrule [07] to only about 3 degrees of motion during an alignment which is performed by manipulating the optical ferrule using, for example, a vacuum chuck. Once positioned and aligned over the second substrate [15] , the optical ferrule can be held in place using a vacuum suction holder, for example, to allow the positioning of the centers of each of the fibers (also referred to as the centers of the coupling surfaces of the fibers) in the second group of four optical fibers over each one of the active areas of the elements in the array of elements of the photodetector chip [15] .

[0068] The second substrate [15] is then attached or epoxy cured in place to the body of the optical ferrule along side the first substrate [13] resulting in the assembly as illustrated in Fig. 04a (without the epoxy being shown) . Other types or combinations of attaching devices can be chosen depending on the attachment reliability level needed for a particular assembly. For example, such attaching devices can also be ultrasonic bonding, thermal bonding, or a mechanical clamp.

[0069] It should be noted that any means for attaching the substrates [13] and [15] to the structure [07] may be used. Furthermore, any mechanical means for holding in place the structure [07] and/or the substrates [13] and [15] during the alignment procedure may be used.

[0070] Once the second substrate [15] is attached to the body of the optical ferrule alongside the first substrate [13] , a defined gap [23] between the two substrates exists but its exact shape is determined by the initial positioning of the VCSEL and Photodetector chips on their respective substrates. The gap allows the position of the array chip [11] on the second substrate [15] to be independent of the position of the array chip [9] on the first substrate [13] while having the arrays [9] and [11] aligned with the coupling surface of their corresponding optical fiber [21] .

[0071] Other optical guiding structures can be envisioned for this geometry, including lens arrays and parts made from polymer waveguiding materials. The basic premise is to align two very small parts to the same optical guiding structure - given that each part is on its own, larger, sub-mount and there is a provisioned amount of positional tolerance in the assembly to accommodate the independent movement of each sub-mount. This is in contrast to aligning the very small parts to each other and then aligning to an optical guiding structure.

[0072] The skilled person in the art will appreciate that in the above description, the optoelectronic chips [9] and [11] , together with their respective substrate [13] and [15] , represent packages having an array of elements. The optical components can be any type of semiconductor devices having light emitting, light detecting or light guiding (such as microlenses) capabilities. Each of the elements is further characterized as having an active area to be aligned with the beveled ends of the optical fibers in the structure when abutting the packages on the structure.

[0073] The above description refers to an optical assembly having two substrates, or two packages each comprising a substrate with elements being on the substrate. It is understood that an assembly having more than two packages can be assembled without departing from the scope of the description. The substrates can also be of any material other than alumina which is suitable for the placement of the elements desired, such as Silicon or Germanium alloys for example.

[0074] Moreover, the packages may be abutted against the structure in other manners as described, with or without the use of a spacing device to provide for a space between the elements of the packages and the optical fibers in the structure.

[0075] While the present description refers to a structure 07 having a beveled end, the structure end may have any shape. In this case, the structure is made of a transparent material so that a user may see the beveled surface 21 through the structure 07 in order to position the arrays of optoelectronic devices. Furthermore, when the structure 07 is transparent, the beveled end 21 can be located at any position along the groove.

[0076] It should be understood that any optical waveguide may be embedded in the structure [07] . The optical waveguide may have any dimensions and cross-sectional shape.

[0077] It should be understood that any packages adapted to receive the optical components arrays [09] and [11] thereon may be used to replace the substrates [13] and [15] . The packages may be made of any material and may have any shape. In one embodiment, the dimensions of the packages or the substrates

[13] and [15] are greater than those of the arrays [09] and

[11] •

[0078] While the present description refers to V-grooves, it should be understood that grooves having any shape and dimensions adapted to receive an optical waveguide may be used. The grooves may be positioned in a parallel or non-parallel manner .