Title:
ULTRA-THIN MICRO-BRIDGE RECTIFIER
Document Type and Number:
WIPO Patent Application WO/2019/210651
Kind Code:
A1
Abstract:
Disclosed by the present invention is an ultra-thin micro-bridge rectifier, comprising a pin, a chip and a welding surface, wherein the pin and the welding surface are connected therebetween by means of an inclined segment, and the chip is mounted on the welding surface. The present invention solves the technical problems in existing technology in which the occupied space of a rectifier chip is large, the current of the rectifier is small, and welding difficulty is high.
Inventors:
LU MINQIN (CN)
NIE LEI (CN)
NIE LEI (CN)
Application Number:
PCT/CN2018/110814
Publication Date:
November 07, 2019
Filing Date:
October 18, 2018
Export Citation:
Assignee:
YANGZHOU HY TECHNOLOGY DEV CO LTD (CN)
International Classes:
H01L25/07
Foreign References:
| CN103401438A | 2013-11-20 | |||
| CN202839600U | 2013-03-27 | |||
| CN206834176U | 2018-01-02 | |||
| US20140264860A1 | 2014-09-18 | |||
| CN108389854A | 2018-08-10 |
Attorney, Agent or Firm:
KEYCOM PARTNERS, P.C. (CN)
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