Title:
ULTRASONIC BONDING APPARATUS, METHOD FOR ULTRASONIC BONDING, AND SEALING ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO/2010/038295
Kind Code:
A1
Abstract:
An ultrasonic bonding apparatus (1) bonds a storage member (30) for housing an electronic material member (50) and a lid material (20) by applying the ultrasonic vibration in parallel to bonding surfaces (21) and (31) respectively. The ultrasonic bonding apparatus (1) includes a support member (40) where the storage member (30) is mounted, a holding means (11) that holds the lid material (20) and moves to a corresponding position on the storage member (30), while applying pressure with the lid material (20) and the storage member (30) interposed between the support member (40), and a bonding means (10) to perform ultrasonic bonding of a part of the bonding surfaces (21) and (31) by applying ultrasonic waves to the holding means (11).
Inventors:
HIROTA HIROYOSHI (JP)
SUNAGA SEIJIRO (JP)
ISHIBASHI YUJI (JP)
SUNAGA SEIJIRO (JP)
ISHIBASHI YUJI (JP)
Application Number:
PCT/JP2008/067861
Publication Date:
April 08, 2010
Filing Date:
October 01, 2008
Export Citation:
Assignee:
PIONEER CORP (JP)
PIONEER FA CORP (JP)
HIROTA HIROYOSHI (JP)
SUNAGA SEIJIRO (JP)
ISHIBASHI YUJI (JP)
PIONEER FA CORP (JP)
HIROTA HIROYOSHI (JP)
SUNAGA SEIJIRO (JP)
ISHIBASHI YUJI (JP)
International Classes:
H03H3/02; B23K20/10; H01L23/02
Foreign References:
| JPS612532A | 1986-01-08 | |||
| JPH11354660A | 1999-12-24 | |||
| JP2001036374A | 2001-02-09 | |||
| JP2002231838A | 2002-08-16 | |||
| JP2001237333A | 2001-08-31 |
Attorney, Agent or Firm:
EGAMI, Tatsuo et al. (JP)
Tatsuo Egami (JP)
Tatsuo Egami (JP)
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