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Title:
ULTRASONIC BONDING DEVICE, ULTRASONIC BONDING INSPECTION METHOD, AND METHOD FOR MANUFACTURING ULTRASONIC BONDING UNIT
Document Type and Number:
WIPO Patent Application WO/2018/143410
Kind Code:
A1
Abstract:
An ultrasonic bonding device (50) comprises: an ultrasonic bonding machine (20) that has an ultrasonic tool (21) for applying ultrasonic waves while pressing bonding members (4, 5) on a member to be bonded (10) mounted on an object to be fixed (1) that is fixed on a jig (24); and a bonding inspection device (30) that inspects the bonding quality of the member to be bonded (10) with the bonding members (4, 5). The bonding inspection device (30) comprises: a bonding state measurement device (31) that detects vibration in a jig (24) or a housing (28) of the ultrasonic bonding machine (20) in which the jig (24) is installed, and outputs a detection signal (sig1); and a bonding state determination device (32) that, in a step for bonding the member to be bonded (10) and the bonding members (4, 5), determines the bonding state of the member to be bonded (10) with the bonding members (4, 5) on the basis of the detection signal (sig1) outputted by the bonding state measurement device (31).

Inventors:
EGUSA MINORU (JP)
SUDO SHINGO (JP)
HASHIMOTO KAZUYUKI (JP)
SUZUKI ERUBI (JP)
Application Number:
JP2018/003605
Publication Date:
August 09, 2018
Filing Date:
February 02, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (Postcode1008310, JP)
International Classes:
H01L21/607; B23K20/10; G01H17/00; G01N29/14; H01L21/60
Foreign References:
JP2004058523A2004-02-26
JPH11197854A1999-07-27
JPH05115986A1993-05-14
JPH0735668A1995-02-07
JP2004047944A2004-02-12
JP2016119374A2016-06-30
Attorney, Agent or Firm:
OIWA Masuo et al. (Postcode6610033, JP)
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