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Patent Searching and Data


Title:
ULTRASONIC BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/067198
Kind Code:
A1
Abstract:
Provided is an ultrasonic bonding device with which the bonding strength of workpieces can be improved. This ultrasonic bonding device uses a pressure application device to press a plurality of workpieces having been placed on an anvil by using a tip-end portion 6b of a horn tip, and bonds the plurality of workpieces by means of ultrasonic vibration in which a vibration component in a first direction perpendicular to the pressing direction and a vibration component in a second direction intersecting the first direction are combined. The tip-end portion 6b of the horn tip has a plurality of dimples D, which are separated from one another and the opening edges of which are closed.

Inventors:
MITSUYUKI JUN (JP)
Application Number:
PCT/JP2019/037673
Publication Date:
April 02, 2020
Filing Date:
September 25, 2019
Export Citation:
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Assignee:
LINK US CO LTD (JP)
International Classes:
B23K20/10; B29C65/08
Foreign References:
JP2017064779A2017-04-06
JPH01139986U1989-09-25
JP2011110839A2011-06-09
JP2015016504A2015-01-29
JP2017162635A2017-09-14
JP4874445B22012-02-15
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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