Title:
ULTRASONIC BONDING METHOD AND ULTRASONIC BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/092809
Kind Code:
A1
Abstract:
As the weight, thickness, and size of a portable electronic device are reduced, a conventional method for bonding a FPC to a circuit board using a connector and/or solder, ACF, NCF, etc., is not reasonable because the component cost is high, the number of mounting processes is large, the mounting time is long, the mounting temperature is high, the bonding thrust is high, the bonding resistance is large, and the repair property is low in the conventional method. The bonding operation for a lightweight, thin, and small electronic device can be realized at a low cost, a small number of processes, a short period of time, a low temperature, a low load, a low resistance, and a high repair property, because a heating ultrasonic horn shaped like a projected blade having a tip perpendicular to the vibration direction and a section perpendicular to the pressing surface, is disposed so that the heating ultrasonic horn is vibrated in a direction parallel to the bonding surface and the electrode direction; the electrodes of the FPC and the circuit are metal-bonded by overlapping the electrodes before heating and vibrating the electrodes while a predetermined pressure is vertically applied to the bonding surface; and the FPC and the PCB are bonded using resin.
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Inventors:
YAGIHARA Toshio (5106-15 Ohmori-Minami 4-chome Oota-k, Tokyo 13, 〒1430013, JP)
八木原 俊夫 (〒13 東京都大田区大森南４丁目６番地１５－５１０ 株式会社コグコフ内 Tokyo, 〒1430013, JP)
KODAMA Makoto (5106-15 Ohmori-Minami 4-chome Oota-k, Tokyo 13, 〒1430013, JP)
八木原 俊夫 (〒13 東京都大田区大森南４丁目６番地１５－５１０ 株式会社コグコフ内 Tokyo, 〒1430013, JP)
KODAMA Makoto (5106-15 Ohmori-Minami 4-chome Oota-k, Tokyo 13, 〒1430013, JP)
Application Number:
JP2010/051061
Publication Date:
August 04, 2011
Filing Date:
January 27, 2010
Export Citation:
Assignee:
COGCOF Japan Corporation (510 6-15 Ohmori-Minami 4-chome Oota-ku, Tokyo, 13, 〒1430013, JP)
株式会社コグコフ (〒13 東京都大田区大森南４丁目６番地１５－５１０ Tokyo, 〒1430013, JP)
ESB Inc. (6005-1, Irino-cho Nishi-ku, Hamamatsu-sh, Shizuoka 61, 〒4328061, JP)
ＥＳＢ株式会社 (〒61 静岡県浜松市西区入野町６００５－１ Shizuoka, 〒4328061, JP)
YAGIHARA Toshio (5106-15 Ohmori-Minami 4-chome Oota-k, Tokyo 13, 〒1430013, JP)
株式会社コグコフ (〒13 東京都大田区大森南４丁目６番地１５－５１０ Tokyo, 〒1430013, JP)
ESB Inc. (6005-1, Irino-cho Nishi-ku, Hamamatsu-sh, Shizuoka 61, 〒4328061, JP)
ＥＳＢ株式会社 (〒61 静岡県浜松市西区入野町６００５－１ Shizuoka, 〒4328061, JP)
YAGIHARA Toshio (5106-15 Ohmori-Minami 4-chome Oota-k, Tokyo 13, 〒1430013, JP)
International Classes:
H05K3/36; B23K20/10
Attorney, Agent or Firm:
MATSUI Shinichi (Akasaka nanabankan 509, 6-41 Akasaka 7-chomeMinato-ku, Tokyo 52, 〒1070052, JP)
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Claims: