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Title:
ULTRASONIC BONDING METHOD USING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2011/145853
Kind Code:
A2
Abstract:
The present invention provides an ultrasonic bonding method using an adhesive film, comprising the following steps: (a) allowing an adhesive film to be in contact with a first member to be bonded; and (b) allowing a second member to be bonded to come into contact with the adhesive film in contact with the first member to be bonded, and melting or curing the adhesive film by using an ultrasonic generator to bond the first member to be bonded and the second member to be bonded. According to the present invention, it is possible to provide a bonding method capable of remarkably improving an adhesive force between a first member to be bonded and a second member to be bonded without change in the appearance and quality of the first member to be bonded and the second member to be bonded, through selective melting of an adhesive film by using an ultrasonic bonding method using an adhesive film.

Inventors:
KIM SEOK JIN (KR)
YOON SEONG HO (KR)
SONG CHEOL KYU (KR)
KONG YAE SOON (KR)
AN DEOK MO (KR)
Application Number:
PCT/KR2011/003600
Publication Date:
November 24, 2011
Filing Date:
May 16, 2011
Export Citation:
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Assignee:
IKM CO LTD (KR)
KIM SEOK JIN (KR)
YOON SEONG HO (KR)
SONG CHEOL KYU (KR)
KONG YAE SOON (KR)
AN DEOK MO (KR)
Foreign References:
KR20070060059A2007-06-12
KR20000048038A2000-07-25
KR100342961B1
KR20070016769A2007-02-08
KR100560071B12006-03-13
Attorney, Agent or Firm:
LEE, SOO YEOL (KR)
이수열 (KR)
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Claims: