Title:
ULTRASONIC CONDUCTION GRINDING MODULE
Document Type and Number:
WIPO Patent Application WO/2022/134866
Kind Code:
A1
Abstract:
An ultrasonic conduction grinding module, comprising a vibration source (1), which comprises a plurality of piezoelectric plates (11), and a conductive plate group (12) having at least one first conductive plate (121) and at least one second conductive plate (122), the conductive plate group (12) being used to enable the piezoelectric plates (11) to be in a parallel configuration, the piezoelectric plates (11) abutting against an elastic body (14), and a connector (15) penetrating the elastic body (14) and the piezoelectric plates (11); a deflector (2), an outer side thereof being provided with a conical body; and an amplitude rod (3), an inner side thereof being provided with an adaptor ring (31) in a radial protruding manner, and an outer side thereof extending axially and being connected to a shaft rod (32) of at least one grinding wheel (4), wherein an inner side of the shaft rod (32) is axially provided with a conical channel (321) that is complementary to the taper of the conical body; and the shaft rod is further provided with a locking hole (322) axially formed therein that is in communication with the conical channel (321) for locking the connector (15). The ultrasonic conduction grinding module can make debris from workpieces fall down under the action of radial high-frequency vibration, and can also improve the grinding efficiency while reducing the wear of grinding plates.
Inventors:
LI WU (CN)
LI HUILING (CN)
LI HUILING (CN)
Application Number:
PCT/CN2021/127940
Publication Date:
June 30, 2022
Filing Date:
November 01, 2021
Export Citation:
Assignee:
SHENZHEN TELLUS WEI TECH CO LTD (CN)
International Classes:
B24B1/04; B24B37/11; B24B37/34
Foreign References:
| CN112658820A | 2021-04-16 | |||
| US3239965A | 1966-03-15 | |||
| TWM567669U | 2018-10-01 | |||
| TWI657869B | 2019-05-01 | |||
| CN102267139A | 2011-12-07 | |||
| CN203330878U | 2013-12-11 |
Attorney, Agent or Firm:
IPINFO&LAWS OFFICE (CN)
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