Title:
ULTRASONIC DEVICE, ULTRASONIC MODULE, AND ULTRASONIC MEASURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/188072
Kind Code:
A1
Abstract:
Provided are an ultrasonic device, an ultrasonic module and an ultrasonic measuring device that have a high ultrasonic wave transmission and reception efficiency.
This ultrasonic device is provided with: a base plate which has a first opening and a second opening; a support film which is provided on the base plate and which occludes the first opening and the second opening; a transmission piezoelectric film which is provided on the support film, is provided in a location overlapping the first opening when seen in the thickness direction of the base plate, and is sandwiched between a pair of electrodes in the thickness direction of the base plate; and a reception piezoelectric film which is provided on the support film, is provided in a location overlapping the second opening when seen in the thickness direction of the base plate, and is sandwiched between a pair of electrodes in the thickness direction of the base plate; wherein the thickness dimension of the transmission piezoelectric film in the thickness direction of the base plate is less than the thickness of the reception piezoelectric film.
Inventors:
MIYAZAWA HIROMU (JP)
ITO HIROSHI (JP)
NAKAMURA TOMOAKI (JP)
YAMADA MASAYOSHI (JP)
KIYOSE KANECHIKA (JP)
FUNASAKA TSUKASA (JP)
ITO HIROSHI (JP)
NAKAMURA TOMOAKI (JP)
YAMADA MASAYOSHI (JP)
KIYOSE KANECHIKA (JP)
FUNASAKA TSUKASA (JP)
Application Number:
PCT/JP2017/015635
Publication Date:
November 02, 2017
Filing Date:
April 18, 2017
Export Citation:
Assignee:
SEIKO EPSON CORP (JP)
International Classes:
H04R17/00; A61B8/14; H01L41/04; H01L41/09; H01L41/113
Domestic Patent References:
| WO2016002971A1 | 2016-01-07 |
Foreign References:
| JP2013005137A | 2013-01-07 | |||
| JP2011234073A | 2011-11-17 | |||
| JP2002085361A | 2002-03-26 | |||
| US20110062535A1 | 2011-03-17 |
Attorney, Agent or Firm:
WATANABE Kazuaki et al. (JP)
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