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Title:
ULTRASONIC JOINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/105434
Kind Code:
A1
Abstract:
Provided is an ultrasonic joining apparatus that can easily change an elliptical ratio and an amplitude of a complex vibration. The ultrasonic joining apparatus 1 comprises an ultrasonic LT horn 4 that transmits an ultrasonic vibration to a horn chip 6, wherein the horn chip 6 is attached to a lower side of a tip portion 4b of the ultrasonic LT horn 4, and detachable adjustment screws 5 are attached to positions (screw holes 4b1, 4b2, and 4b4) of the tip portion 4b, which do not interfere with the horn chip 6.

More Like This:
WO/2014/000975DEVICE AND METHOD FOR ULTRASONIC WELDING
JPH03184679METHOD FOR WELDING FUNCTIONAL PARTS SUCH AS BIMETAL SWITCH UTILIZING ULTRASONIC WELDING
Inventors:
MITSUYUKI JUN (JP)
Application Number:
PCT/JP2019/043483
Publication Date:
May 28, 2020
Filing Date:
November 06, 2019
Export Citation:
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Assignee:
LINK US CO LTD (JP)
International Classes:
B23K20/10; B29C65/08
Foreign References:
JPH10323620A1998-12-08
JP2017064779A2017-04-06
JPH09108855A1997-04-28
JPH1052768A1998-02-24
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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