Title:
ULTRASONIC PLATE THICKNESS MEASUREMENT DEVICE, MACHINE TOOL PROVIDED WITH SAME, AND ULTRASONIC PLATE THICKNESS MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2016/056499
Kind Code:
A1
Abstract:
An ultrasonic plate thickness measurement device (9) is provided with a taper shank (13) having the same shape as the taper shank of an interchangeable tool that is selectively attached to the main shaft (2) of a machine tool and an ultrasonic plate thickness measurement unit (16) that is provided on this taper shank (13), emits ultrasound while an ultrasonic probe (25) at the leading end thereof is made to be in contact with the surface of a workpiece (W), detects the resulting echo waves, measures the thickness of the workpiece (W), and wirelessly transmits the resulting measurement data to a control unit (48). Coolant supplied when the machine tool cuts the workpiece (W) using the interchangeable tool is used as a contact medium for enhancing the contact state between the ultrasonic probe (25) and workpiece (W) surface during thickness measurement. The coolant is ejected from a main shaft ejection nozzle (55) provided on the main shaft (2) and a measurement ejection nozzle (60) provided on the ultrasonic plate thickness measurement device (9).
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Inventors:
ETO JUN (JP)
Application Number:
PCT/JP2015/078165
Publication Date:
April 14, 2016
Filing Date:
October 05, 2015
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
G01B17/02; B23Q11/10; B23Q17/20
Domestic Patent References:
| WO2010020940A1 | 2010-02-25 |
Foreign References:
| JP2010052103A | 2010-03-11 | |||
| JPS63209U | 1988-01-05 | |||
| JPH02110309A | 1990-04-23 |
Attorney, Agent or Firm:
FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
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