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Patent Searching and Data


Title:
ULTRASONIC PROBE, ARRAY ELEMENT CONNECTING ELEMENT THEREOF AND ULTRASONIC IMAGING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2014/094445
Kind Code:
A1
Abstract:
An array element connecting element (21) of an ultrasonic probe comprises a first-layer main body (210) and a second-layer main body (211), wherein the second-layer main body (211) is bonded to the first-layer main body (210), and an area of the second-layer main body (211) is smaller than an area of the first-layer main body (210). On an area of the first-layer main body (210) that comes out of the second-layer main body (211), at least one first-layer conductive element (2105) that runs through the first-layer main body (210) is arranged. On a lower surface of the second-layer main body (211), at least one second-layer conductive element (2115) that runs through the second-layer main body (211) and the first-layer main body (210) is arranged. The first-layer conductive element (2105) and the second-layer conductive element (2115) connect a signal transmission line (22) to an array element. The connecting element is in a stepped shape. The signal transmission line (22) is connected to an array element component (20) through the array element connecting element (21) in the stepped shape, which thus can provide sufficient space used for connection between the signal transmission line (22) and the array element component (20).

Inventors:
CHEN ZHENYU (CN)
TANG MING (CN)
Application Number:
PCT/CN2013/081908
Publication Date:
June 26, 2014
Filing Date:
August 20, 2013
Export Citation:
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Assignee:
SHENZHEN MINDRAY BIO MED ELECT (CN)
International Classes:
B60B1/06; A61B8/00
Foreign References:
US5329498A1994-07-12
US5559388A1996-09-24
US20030085635A12003-05-08
CN101103927A2008-01-16
Attorney, Agent or Firm:
ADVANCE CHINA I.P.LAW OFFICE (CN)
广州华进联合专利商标代理有限公司 (CN)
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