Title:
ULTRASONIC PROBE, ULTRASONIC DIAGNOSIS DEVICE, AND METHOD FOR MANUFACTURING ULTRASONIC PROBE
Document Type and Number:
WIPO Patent Application WO/2022/209772
Kind Code:
A1
Abstract:
The present invention provides an ultrasonic probe adaptive to high-frequency driving, a method for manufacturing the ultrasonic probe, and an ultrasonic diagnosis device. An ultrasonic probe (100) is provided with an acoustic matching part (20) disposed on a plurality of piezoelectric elements (10), and a conductive member (30Fr) disposed on the plurality of piezoelectric elements (10) adjacently to the acoustic matching part (20). The conductive member (30Fr) includes a conductor layer having a multilayer structure, the conductor layer being disposed on the front-side of the acoustic matching part (20) in a front-rear direction FR. This conductor layer having a multilayer structure includes a plurality of first conductor layers (32F) respectively joined to second conductive parts (13) of the piezoelectric elements (10), and a second conductor layer (31F) laminated on the plurality of first conductor layers (32F) and electrically connecting the plurality of first conductor layers (32F). Regarding the first conductor layers (32F), the ratio of the thickness HF in the up-down direction UD to the width D1 in the left-right direction LR is less than or equal to 1.6.
Inventors:
HASE TAKATOSHI (JP)
Application Number:
PCT/JP2022/010981
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H04R17/00; A61B8/00; H04R31/00
Domestic Patent References:
| WO2018070159A1 | 2018-04-19 | |||
| WO2018070159A1 | 2018-04-19 |
Foreign References:
| JP2021063176A | 2021-04-22 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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