Title:
ULTRASONIC SENSOR AND VIBRATION ABSORBER
Document Type and Number:
WIPO Patent Application WO/2021/215177
Kind Code:
A1
Abstract:
This vibration absorber (5) includes a large diameter portion (58) and a small diameter portion (59). The large diameter portion is provided so as to be sandwiched between an ultrasonic microphone (4) and a sensor mounting tool (7) while being in contact with the ultrasonic microphone and the sensor mounting tool. The small diameter portion, the outer diameter of which is centered on a center axial line (CL), is formed smaller than the large diameter portion, and is provided so as to be adjacent to the large diameter portion in the circumferential direction surrounding the center axial line. A pair of the large diameter portions are disposed to face each other across the center axial line. A pair of the small diameter portions are disposed to face each other across the center axial line. The vibration absorber is configured such that an arrangement direction of the pair of large diameter portions sandwiching the center axial line and an arrangement direction of the pair of small diameter portions sandwiching the center axial line are orthogonal to each other.
Inventors:
UEDA KEISUKE (JP)
HARADA TAKETO (JP)
HARADA TAKETO (JP)
Application Number:
PCT/JP2021/011963
Publication Date:
October 28, 2021
Filing Date:
March 23, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
G01S7/521; G01S15/931; H04R1/02
Domestic Patent References:
| WO2013051524A1 | 2013-04-11 |
Foreign References:
| JP2015200579A | 2015-11-12 | |||
| JP2011209233A | 2011-10-20 | |||
| JP2006054647A | 2006-02-23 | |||
| JP2012032167A | 2012-02-16 | |||
| KR20150033124A | 2015-04-01 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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